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pro vyhledávání: '"Yoshiki Shirasu"'
Autor:
Hiromasa Ohmi, Jumpei Sato, Yoshiki Shirasu, Tatsuya Hirano, Hiroaki Kakiuchi, Kiyoshi Yasutake
Publikováno v:
ACS Omega, Vol 4, Iss 2, Pp 4360-4366 (2019)
Externí odkaz:
https://doaj.org/article/59fb4d8a2cc84cfc82f5436e5dff5e56
Autor:
Kiyoshi Yasutake, Hiromasa Ohmi, Jumpei Sato, Tatsuya Hirano, Hiroaki Kakiuchi, Yoshiki Shirasu
Publikováno v:
ACS Omega, Vol 4, Iss 2, Pp 4360-4366 (2019)
ACS Omega
ACS Omega
The characteristics of copper (Cu) isotropic dry etching using a hydrogen-based plasma generated at 13.3 kPa (100 Torr) were improved dramatically by simply introducing a moderate amount of N2 gas into the process atmosphere. A maximum Cu etch rate o