Zobrazeno 1 - 10
of 38
pro vyhledávání: '"Yoshihiro Kashiba"'
Publikováno v:
Materials & Design, Vol 160, Iss , Pp 475-485 (2018)
Thin metallic Cu and Ni meshes were successfully embedded within SAC305 solder joints. Defects (residues) within the joint were removed by a vacuum step in the bonding sequence. The metallic mesh inlets were metallurgically bonded by the formation of
Externí odkaz:
https://doaj.org/article/9278a06d27cb49f6889a31f6282b020d
Autor:
Hiroaki Tatsumi, Hiroshi Yamaguchi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose
Publikováno v:
Applied Sciences, Vol 9, Iss 17, p 3476 (2019)
We have proposed a low-temperature bonding technology utilizing the sintering of Cu particles with transient liquid-phase of Sn-based solder, called transient liquid-phase sintering (TLPS), as a die-attach solution for high-temperature power modules.
Externí odkaz:
https://doaj.org/article/6851dd205c22421098742b3008cf7cfd
Autor:
Hiroaki Tatsumi, Adrian Lis, Hiroshi Yamaguchi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose
Publikováno v:
Applied Sciences, Vol 9, Iss 1, p 157 (2019)
The evolution of the transient liquid-phase sintered (TLPS) Cu–Sn skeleton microstructure during thermal aging was evaluated to clarify the thermal reliability for die-attach applications. The Cu–Sn skeleton microstructure, which consists of Cu p
Externí odkaz:
https://doaj.org/article/c31edac4193340be9e3644d62b9323b0
Autor:
Tomoki Matsuda, Jungeun Kim, Hisashi Yashiro, Tomokazu Sano, Sato Kenji, Yoshihiro Kashiba, Keigo Nagao, Akio Hirose, Daiki Yamagiwa, Hideki Furusawa
Publikováno v:
Journal of Electronic Materials. 51:1-7
The reduction behavior of the surface oxide on Cu particles under a reducing gas atmosphere was investigated for a pressureless sinter joining. We conducted x-ray thermodiffraction analysis and simultaneous thermogravimetry, differential thermal anal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6ccb46e1b8fa10f1f7e7cfdd6e99caf9
https://doi.org/10.1007/s11664-021-09274-z
https://doi.org/10.1007/s11664-021-09274-z
Autor:
Yoshihiro Kashiba, Akio Hirose, Tomoki Matsuda, Hideki Furusawa, Sato Kenji, Daiki Yamagiwa, Tomokazu Sano, Hiroaki Tatsumi
Publikováno v:
Journal of Materials Science: Materials in Electronics. 32:19031-19041
Pressureless sinter joining of bare Cu substrates using submicron Cu particles was successfully achieved at 250–300 °C in N2–3%H2 forming gas atmosphere via the in-situ generation of Cu nanoparticles reduced from a thin oxide layer present on th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8a601431efe33babc396490edd0171ae
https://doi.org/10.1007/s10854-021-06418-z
https://doi.org/10.1007/s10854-021-06418-z
Autor:
Yoshihiro Kashiba
Publikováno v:
Journal of Smart Processing. 9:250-254
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b032166ab17cc926908774ee92618dc2
https://doi.org/10.7791/jspmee.9.250
https://doi.org/10.7791/jspmee.9.250
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:2111-2121
Transient liquid-phase sintering (TLPS) using a Cu-solder-resin composite for the die-attach application of high-temperature silicon carbide (SiC) power modules was evaluated with the goal of controlling the joint stiffness. The Cu-solder-resin compo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d1f7d5ccf100468443fe418b7191c846
https://doi.org/10.1109/tcpmt.2019.2916053
https://doi.org/10.1109/tcpmt.2019.2916053
Autor:
Michiya Matsushima, Shinji Fukumoto, Kozo Fujimoto, Yoshihiro Kashiba, Kengo Ohta, Tatsunori Yanagimoto, Kikuchi Masao
Publikováno v:
MATERIALS TRANSACTIONS. 60:602-610
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::43cd46c1622b6aad06f381348adcfea1
https://doi.org/10.2320/matertrans.m2018295
https://doi.org/10.2320/matertrans.m2018295
Publikováno v:
Materials & Design, Vol 160, Iss, Pp 475-485 (2018)
Thin metallic Cu and Ni meshes were successfully embedded within SAC305 solder joints. Defects (residues) within the joint were removed by a vacuum step in the bonding sequence. The metallic mesh inlets were metallurgically bonded by the formation of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::749477c7fa188d0ff7cc039bf1f4ccc7
https://doi.org/10.1016/j.matdes.2018.09.017
https://doi.org/10.1016/j.matdes.2018.09.017
Publikováno v:
International Symposium on Microelectronics. 2018:000470-000475
Press-fit technology has been expected as a mounting technique instead of soldering in power electronics. To apply press-fit technology to power modules, the basic behavior of the contact resistance and an interface reaction of the press-fit contact
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::db3e96ee9e244fa85ca5740c2a3a85f1
https://doi.org/10.4071/2380-4505-2018.1.000470
https://doi.org/10.4071/2380-4505-2018.1.000470