Zobrazeno 1 - 10
of 24
pro vyhledávání: '"Yoshihiro Bessho"'
Publikováno v:
Microelectronics Reliability. 41:525-530
A bare LSI chip mounted onto a flexible substrate is called chip-on-flex (COF). Companies and universities are desperately developing COF. In this paper, the development of COF using stud bump bonding (SBB) flip-chip technology will be introduced. So
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::867132372bcb358e07cfb8fbd17225e3
https://doi.org/10.1016/s0026-2714(00)00258-4
https://doi.org/10.1016/s0026-2714(00)00258-4
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 3:114-119
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c8c8cfc085f4e7ac0bae309f1642bdd9
https://doi.org/10.5104/jiep.3.114
https://doi.org/10.5104/jiep.3.114
Publikováno v:
Microelectronics International. 14:15-18
A zero X‐Y shrinkage low temperature cofired ceramic (LTCC) substrate was developed, which was applied to flip‐chip bonded chip‐size packages (CSPs) and multichip modules (MCMs). The Ag internal conductor, the AgPd external conductor and the ne
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fdcdd1952a5c47877997fd98d7832b04
https://doi.org/10.1108/13565369710195315
https://doi.org/10.1108/13565369710195315
Autor:
Hiroshi Takahara, Tatuhiko Tamura, Kazunori Komori, Hiroshi Iwai, Itirou Yamashita, Yoshihiro Bessho, Yoneharu Takubo, Mamoru Takeda, Kenji Ukita
Publikováno v:
The Journal of the Institute of Television Engineers of Japan. 44:544-549
ハイビジョン用液晶投写型テレビに応用できる高密度TFTアレイを開発した.高密度で高開口率を実現するために反射型構造を提案した.また, 対角約2, 3インチの基板内に約136万画素を集積
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::936c2f4444fa01662de693bf73d28bad
https://doi.org/10.3169/itej1978.44.544
https://doi.org/10.3169/itej1978.44.544
Publikováno v:
Proceedings of Japan International Electronic Manufacturing Technology Symposium.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e0821f91f3f08c0b9aeb6ebc8969373b
https://doi.org/10.1109/iemt.1993.639373
https://doi.org/10.1109/iemt.1993.639373
Publikováno v:
Proceedings of Japan International Electronic Manufacturing Technology Symposium.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::722fb630e5e94cc0660b34f2e94f8d2c
https://doi.org/10.1109/iemt.1993.639807
https://doi.org/10.1109/iemt.1993.639807
Publikováno v:
Scopus-Elsevier
A zero X-Y shrinkage low temperature cofired ceramic (LTCC) substrate was developed, that was applied to the flip-chip bonded chip-size-packages (CSPs) and multi-chip modules (MCMs). The Ag internal conductor,the AgPd external conductor and the newly
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0e67748969d57c342fb74aa891976ff6
https://doi.org/10.1109/iemt.1996.559717
https://doi.org/10.1109/iemt.1996.559717
Publikováno v:
2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225).
We have developed an advanced MCM (multichip module) using the SBB/sup TM/ (stud-bump bonding) flip-chip technique on an ALIVH/sup TM/ (any layer inner via hole) structure substrate. The SBB technique is an advanced flip-chip bonding technique for hi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c291e5b9518fd9cbbfea6469237c6546
https://doi.org/10.1109/iemtim.1998.704631
https://doi.org/10.1109/iemtim.1998.704631
Autor:
Yoshihiro Bessho, K. Sakamaoto, Kazuo Eda, Tsukasa Shiraishi, K. Amami, K. Fukuoka, Toru Ishida
Publikováno v:
Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154).
This paper describes of a flip chip MPU module on a high performance "ALIVH/sup TM/ (any layer inner via hole)" printed circuit board structure for sub-note PCs using a modified SBB/sup TM/ (stud bump bonding) technique. The SBB technique is an advan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::313754c4eb9d6fb69b31c37bfa30796d
https://doi.org/10.1109/icmcm.1998.670835
https://doi.org/10.1109/icmcm.1998.670835
Autor:
Y. Ishimaru, Yoshihiro Bessho, M. Itagaki, Toru Ishida, Y. Tomura, S. Yuhaku, Kazuo Eda, K. Amami
Publikováno v:
Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154).
A new chip scale package (CSP) using an organic laminated substrate called /spl mu/CSP was developed, which was fabricated using ALIVH substrate as a interposer and stud-bump-bonding (SBB) flip-chip technology. The ALIVH substrate is a multilayered o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6bf59144dda69a296456884a20bf6173
https://doi.org/10.1109/icmcm.1998.670786
https://doi.org/10.1109/icmcm.1998.670786