Výsledky vyhledávání - "Yorita, Chiko"

Conference

Hybrid silicon and glass interposer for combined optical and memory system-in-package.

Autor: Uematsu, Yutaka, Toyama, Masahiro, Yorita, Chiko, Osaka, Hideki

Publikováno v: 2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS); 2014, p5-8, 4p

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Periodical

Effect of Interfacial Reaction on Joint Strength of Semiconductor Metallization and Sn-3Ag-0.5Cu Solder Ball

Autor: Yorita, Chiko, Kobayashi, Tatsuya, Shohji, Ikuo

Publikováno v: Key Engineering Materials; January 2011, Vol. 462 Issue: 1 p849-854, 6p

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Conference

Ground planes resonance suppression technique of glass interposer using high-resistivity via holes for high-speed serial links.

Autor: Toyama, Masahiro, Uematsu, Yutaka, Yorita, Chiko, Osaka, Hideki

Publikováno v: 2015 IEEE 4th Asia-Pacific Conference on Antennas & Propagation (APCAP); 2015, p449-450, 2p

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