Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Yonghyuk Jeong"'
Publikováno v:
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
In this paper, the thermal performances of a Chiplet module with different numbers of dies were studied. The Chiplet module was assumed to be placed in the same server system, with the same ambient condition, and using the same heat sink. A thermal s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68b7c1256d5404f7c62dbbd0ae207194
https://doi.org/10.1115/ipack2022-97204
https://doi.org/10.1115/ipack2022-97204
Publikováno v:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e375b1794a1285d9ae09476e7b195fb
https://doi.org/10.1109/itherm54085.2022.9899583
https://doi.org/10.1109/itherm54085.2022.9899583
Autor:
Michael Liu, Jenn An Wang, JaeMyong Kim, Jae-Pil Kim, Anthony D. Yang, OhYoung Kwon, YongHyuk Jeong, Eric Yang, Eric Ouyang, Susan Lin
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing parameters and processes [1], [2]. Previous research
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::276c07245f6c78eff37c43dc1b660e74
https://doi.org/10.1109/ectc32696.2021.00335
https://doi.org/10.1109/ectc32696.2021.00335
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
The current trends of consumer electronics are to make the devices smaller, faster, better performance, and have more functions. To meet these requirements, semiconductor packaging is moving toward system-in-package (SiP) which is to pack a number of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::69f0751c17cb45007f26fe8030730cab
https://doi.org/10.1109/ectc32862.2020.00320
https://doi.org/10.1109/ectc32862.2020.00320
Autor:
Anthony D. Yang, Jim Hsu, Eric Ouyang, YongHyuk Jeong, SeonMo Gu, JaeMyong Kim, Susan Lin, Billy Ahn, Goran Liu
Publikováno v:
International Symposium on Microelectronics. 2018:000344-000348
In this paper, the impact of two different types of warpage, strip warpage and system-in-packages (SiP) module warpage, are considered and studied, both experimentally and numerically. An advanced material characterization method is also conducted to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::abbd7a25b8b9cdce76a88f20f745b43a
https://doi.org/10.4071/2380-4505-2018.1.000344
https://doi.org/10.4071/2380-4505-2018.1.000344
Autor:
Eric Ouyang, Billy Ahn, SeonMo Gu, Seng Guan Chow, Anonuevo Dexter, YongHyuk Jeong, JaeMyong Kim
Publikováno v:
International Symposium on Microelectronics. 2016:000498-000503
To lower the manufacturing cost of quad flat no-lead (QFN) packages, the number of QFN packages on a leadframe must be increased. However, the increased number of packages or changes to the layout of QFN packages on the leadframe can impact the mold
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::078b1ab0a608a456774d66332fc59725
https://doi.org/10.4071/isom-2016-tha51
https://doi.org/10.4071/isom-2016-tha51
Autor:
Billy Ahn, Anthony D. Yang, Yonghyuk Jeong, Takahiro Horie, Tetsuya Koyama, Masahiro Tsuriya, Jim Hsu, Jeffrey E. Lee, Kiyoshi Oi
Publikováno v:
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
SiP turns to be complex due to increasing the number of components in a given space, narrow gap between die-to-passive or passive-to-passive and narrow clearance between mold top to components. Therefore, molding process becomes a critical process to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f7f8e18d56da5da0c646dbf2fe147fa8
https://doi.org/10.23919/icep.2018.8374658
https://doi.org/10.23919/icep.2018.8374658
Autor:
Billy Ahn, Tetsuya Koyama, Takahiro Horie, Masahiro Tsuriya, Yonghyuk Jeong, Anthony D. Yang, Jeffrey E. Lee, Jim Hsu, Kiyoshi Oi
Publikováno v:
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
Warpage is one big challenge during manufacturing process for advanced packaging, which needs to be addressed for successful process integration. For these challenges, iNEMI has initiated System-in-Package module warpage project which is to understan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::70cac4482989680475a131e1a1426be2
https://doi.org/10.23919/icep.2018.8374659
https://doi.org/10.23919/icep.2018.8374659
Publikováno v:
International Symposium on Microelectronics. 2012:000809-000817
In this paper, the thermal performance data of theta jc (Rth-JC) and theta ja (Rth-JA) of a flip chip ball grid array device with heat spreader, fcBGA-H, is measured. For Rth-JC, various boundary conditions for the thermal resistance modeling are con
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::59db6500bc3323f5b5ff96be613c3821
https://doi.org/10.4071/isom-2012-wp22
https://doi.org/10.4071/isom-2012-wp22
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
For the demand of high density input/output (I/O), finepitch, and low-k materials in copper column bump flip chip packages, Thermal Compression Bonding (TCB) with preapplied Non Conductive Paste (NCP) has been developed in order to ensure manufacturi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::787e49234528c8bcdfb7cbb351aaf387
https://doi.org/10.1109/ectc.2014.6897382
https://doi.org/10.1109/ectc.2014.6897382