Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Yongbin Bai"'
Autor:
Xinbin He, Chong He, Ping Hu, Lifeng Zheng, Qilong Hu, Guoxiang Sun, Yongtao Chu, Yongbin Bai
Publikováno v:
2022 International Conference on Artificial Intelligence of Things and Crowdsensing (AIoTCs).
Publikováno v:
Proceedings of the 7th International Conference on Cyber Security and Information Engineering.
Publikováno v:
Journal of Physics: Conference Series. 2033:012123
Publikováno v:
Journal of Physics: Conference Series. 1802:032094
This paper introduces a set of professional data management system based on polymorphic graphics, which is established according to the requirements of software engineering management. It introduces the key technologies of the system, such as the mai
Publikováno v:
AIP Conference Proceedings.
Big data is becoming another hotspot in the field of information technology after the cloud computing and the Internet of Things. However, the existing information security methods can no longer meet the information security requirements in the era o
Publikováno v:
IOP Conference Series: Materials Science and Engineering. 677:042038
This paper introduces the current development status of cloud computing technology at home and abroad, analyses the history and realistic needs of Enterprise Cloud computing, introduces the IaaS, PaaS and SaaS services in the construction of Enterpri
Autor:
Yu Xin, Wen Dong, Xiaofeng Wang, Mingrong Shen, Xiaoqing Shen, Wen Huang, Fengang Zheng, Liang Fang, Jianhua Hao, Jinxing Zhang, Yongbin Bai
Publikováno v:
J. Mater. Chem. A. 2:1363-1368
Pb(Zr,Ti)O3 (PZT) film with a band gap of 3.6 eV was prepared on In2O3:Sn (ITO) coated glass, and then an amorphous silicon (a-Si) film with a narrow band gap of 1.8 eV was deposited on the PZT/ITO/glass. The short-circuit current of Ag/a-Si/PZT/ITO/
Publikováno v:
Proceedings of the 2017 2nd International Conference on Machinery, Electronics and Control Simulation (MECS 2017).
Publikováno v:
Proceedings of the 2017 2nd International Conference on Machinery, Electronics and Control Simulation (MECS 2017).
Autor:
Yongbin Bai, Hongcai Ma
Publikováno v:
Journal of Applied Mathematics and Physics. :18-24
In this paper, we consider (3 + 1)-dimensional Boiti-Leon-Manna-Pempinelli equation. Based on the bilinear form, we derive exact solutions of (3 + 1)-dimensional Boiti-Leon-Manna-Pempinelli (BLMP) equation by using the Wronskian technique, which incl