Zobrazeno 1 - 10
of 37
pro vyhledávání: '"Yong-huan Guo"'
Publikováno v:
Journal of Materials Research and Technology, Vol 25, Iss , Pp 3754-3767 (2023)
To obtain high-strength joints suitable for three-dimensional (3D) packaging, SiC nanowires (NWs) were doped to the Sn1.0Ag0.5Cu (SAC105) solder, and the conventional Cu substrate was replaced with nanocrystalline (NC) Cu to form Cu/solder/NC Cu sold
Externí odkaz:
https://doaj.org/article/d0cb1854d7a943878525e0b8b3de4a40
Publikováno v:
Journal of Materials Research and Technology, Vol 24, Iss , Pp 514-526 (2023)
In this paper, various mass fractions (0, 0.1, 0.2, 0.4, 0.6, 0.8 wt%) of Mg particles were added to the Sn58Bi solder to achieve the purpose of modification, through which the Ni substrate was connected successfully through bonding at 250 °C for 2
Externí odkaz:
https://doaj.org/article/1ccfa5ebe735430d8f834fdc70d58334
Publikováno v:
Journal of Materials Research and Technology, Vol 24, Iss , Pp 3643-3656 (2023)
The Cu/Sn58Bi/Cu and Cu/Sn58Bi-0.6B4C/Cu joints were prepared by transient liquid phase (TLP) bonding technology to verify the reliability of low-temperature connection joints. Intermetallic compound (IMC) evolution at the interface under different i
Externí odkaz:
https://doaj.org/article/ee04975da7114946ba4e10f027a38b86
Publikováno v:
Journal of Materials Research and Technology, Vol 23, Iss , Pp 1225-1238 (2023)
The mechanical mixed Sn58Bi solder reinforced by B4C nanoparticles for the interconnect of Cu/Cu same metal was studied. The hardness of solder alloy and shear strength of joints with Sn58Bi-xB4C (x = 0, 0.2, 0.4, 0.6, 0.8, 1.0 wt%) composite solder
Externí odkaz:
https://doaj.org/article/cc82c43fd8984348a1123b282994dd17
Publikováno v:
Journal of Materials Research and Technology, Vol 21, Iss , Pp 4263-4280 (2022)
The IMC (interfacial intermetallic compound) produced by the metallurgical reaction between the solder and the Cu plate enables the packaging of IGBT (insulated gate bipolar transistor) modules. In this paper, the growth behavior of IMCs of Sn58Bi/Cu
Externí odkaz:
https://doaj.org/article/b39373afce984fe0aab7ead97aa8d495
Publikováno v:
Arabian Journal for Science and Engineering. 46:11835-11845
The injection molding process of a mold with multiple cavities can reduce the mold space, but the process is complicated and the product is prone to warpage. In order to reduce the transparent parts warpage of such a mold, by optimizing injection mol
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::db58a6adde6393bfb1d178339744a623
https://doi.org/10.1007/s13369-021-05724-2
https://doi.org/10.1007/s13369-021-05724-2
Publikováno v:
Welding in the World. 65:563-572
AHSS is widely used in the automobile industry due to its lightweight and high strength. However, the larger carbon equivalent results in poor weldability and causes a severe performance decrease in the performance of the CGHAZ. The thermal simulatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba5f27d4d7b6117fd4949390dc9fa98e
https://doi.org/10.1007/s40194-020-01052-5
https://doi.org/10.1007/s40194-020-01052-5
Publikováno v:
Journal of Materials Science: Materials in Electronics. 26:7629-7634
Microstructures, interface reaction, melting characteristics, tensile property, thermal fatigue behavior and wettability of Sn58Bi, Sn35Bi0.3Ag and Sn35Bi1.0Ag solders were investigated. Only Sn phase and Bi phase like net-type distribute uniformly i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fe4b05d220f14e8e919795a3e9a3972f
https://doi.org/10.1007/s10854-015-3400-x
https://doi.org/10.1007/s10854-015-3400-x
Publikováno v:
Journal of Materials Science: Materials in Electronics. 26:6194-6197
The relationship between Ce content/CeSn3 sizes and the whiskers growth is newly reported systematically. The whiskers growth can be observed in the surface of bulk CeSn3 particles, the rate of whisker growth was significantly slowed with Ce content
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4518bbb923df326b289386c62927dfd4
https://doi.org/10.1007/s10854-015-3202-1
https://doi.org/10.1007/s10854-015-3202-1
Publikováno v:
Rare Metals. 37:161-166
In order to improve the mechanical properties of deposited metal of ilmenite type welding electrode, CeO2/La rare earth elements were added into electrodes based on E4301 electrode, then electrodes were produced, test plates were welded, and mechanic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::554b299a0a6775e1a05000f4b6e3ba6e
https://doi.org/10.1007/s12598-015-0474-9
https://doi.org/10.1007/s12598-015-0474-9