Zobrazeno 1 - 10
of 68
pro vyhledávání: '"Yong-Ho Ko"'
Autor:
Seoah Kim, YehRi Kim, Eunjin Jo, Hyeon-Sung Lee, Sungwook Mhin, Tae-Young Lee, Sehoon Yoo, Yong-Ho Ko, Dongjin Kim
Publikováno v:
Journal of Materials Research and Technology, Vol 30, Iss , Pp 6668-6685 (2024)
This study introduces a novel method for integrating aluminum flexible printed circuit boards (FPCBs) and copper FPCBs into battery management systems (BMS) using and instantaneous large area facial laser source soldering. Achieving a robust bonding
Externí odkaz:
https://doaj.org/article/20087e7b6cdd42df9c1263e0277ab524
Autor:
Gyuwon Jeong, Dong-Yurl Yu, Seongju Baek, Junghwan Bang, Tae-Ik Lee, Seung-Boo Jung, JungSoo Kim, Yong-Ho Ko
Publikováno v:
Materials, Vol 14, Iss 2, p 335 (2021)
The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn–58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn–58Bi based
Externí odkaz:
https://doaj.org/article/3f6a38a695fd4527babac2c9adcea6f7
Publikováno v:
Metals, Vol 11, Iss 2, p 210 (2021)
The nucleation kinetics and morphology of Cu6Sn5 IMCs at the interface between a Sn-0.7Cu-0.2Cr solder and Cu substrate were investigated in this study. A Sn-0.7Cu solder was utilized as a reference to elucidate the impact of Cr addition. The mechani
Externí odkaz:
https://doaj.org/article/285ed120ec714584af2554859ff31872
Publikováno v:
Journal of Civil Engineering and Management, Vol 23, Iss 2 (2017)
As construction projects have become more complicated in design and construction, it is necessary to establish the construction operational plans in advance. However, there were some limitations in analyzing construction productivity due to the dif
Externí odkaz:
https://doaj.org/article/d399a1d301e74cad9d49ae8a72622846
Autor:
Kyoung Ryeol Park, Jae Eun Jeon, Ghulam Ali, Yong-Ho Ko, Jaewoong Lee, HyukSu Han, Sungwook Mhin
Publikováno v:
Catalysts, Vol 9, Iss 6, p 564 (2019)
High-performance oxygen evolution reaction (OER) electrocatalysts are needed to produce hydrogen for energy generation through a carbon-free route. In this work, the solution combustion synthesis (SCS) method was employed to synthesize mixed phases o
Externí odkaz:
https://doaj.org/article/2c542a294e4d4874a4ed547831eedba0
Autor:
Junghwan Bang, Dong-Yurl Yu, Ming Yang, Yong-Ho Ko, Jeong-Won Yoon, Hiroshi Nishikawa, Chang-Woo Lee
Publikováno v:
Metals, Vol 8, Iss 8, p 586 (2018)
The exemption of Pb-bearing automobile electronics in the End of Life Vehicle (ELV) directive has recently expired, bring an urgent need to find Pb-free alloys that can maintain good performance under high-temperature and vibration conditions for aut
Externí odkaz:
https://doaj.org/article/99d03504b48a4eec931bd42810edf792
Autor:
Byeongjin Ahn, Jahyeon Kim, Gyeong-Yeong Cheon, Tae-Ik Lee, Young-Bae Park, Jungsoo Kim, Yong-Ho Ko
Publikováno v:
Journal of Materials Science: Materials in Electronics. 33:21127-21136
Autor:
Jungsoo Kim, Hyun-Soon Park, Sehoon Yoo, Yong-Ho Ko, Dong-Yurl Yu, Yoonchul Sohn, Dae-Young Park
Publikováno v:
Journal of Materials Science: Materials in Electronics. 32:28346-28357
Autor:
Yong-Ho Ko, Gyu-Won Jeong, Min-Su Kim, Han-Bo-Ram Lee, Jungsoo Kim, Seungju Baek, Junhyuk Son
Publikováno v:
Journal of Materials Science: Materials in Electronics. 32:3324-3333
Power modules are being increasingly used as essential parts in eco-friendly vehicles, and they are generally exposed to high temperatures during operation. To this end, electronic interconnection methods that can enhance durability and help withstan
Publikováno v:
Journal of Materials Science: Materials in Electronics. 32:1042-1051
A growth of intermetallic compounds (IMCs) at the interface between electroless Ni/immersion Au (ENIG) and Sn-3.0Ag-0.5Cu (SAC305) solder and related brittle fracture behavior of solder joint with microstructure changes of electroless Ni-P was invest