Zobrazeno 1 - 10
of 118
pro vyhledávání: '"Yong‐Sung Eom"'
Autor:
Yong-Sung Eom, Gwang-Mun Choi, Ki-Seok Jang, Jiho Joo, Chan-mi Lee, Jin-Hyuk Oh, Seok-Hwan Moon, Kwang-Seong Choi
Publikováno v:
ETRI Journal, Vol 46, Iss 2, Pp 347-359 (2024)
A simultaneous transfer and bonding (SITRAB) process using areal laser irradiation is introduced for high-yield and cost-effective production of mini- or micro-light-emitting diode (LED) display panels. SITRAB materials are special epoxy-based solven
Externí odkaz:
https://doaj.org/article/59e765084de140da8c3076a8273977e2
Publikováno v:
Journal of Materials Research and Technology, Vol 28, Iss , Pp 1967-1974 (2024)
A nano porous structured (NPS) Cu layer was fabricated by a Zn plating-annealing-selective etching process. Furthermore, sinter-bonding was performed by thermocompression after forming the NPS Cu layer instead of the conventional paste sinter-bonding
Externí odkaz:
https://doaj.org/article/8281e9206d02475b8cbb50bb02a4743b
Autor:
Xuan-Luc Le, Xuan-Bach Le, Yuhwan Hwangbo, Jiho Joo, Gwang-Mun Choi, Yong-Sung Eom, Kwang-Seong Choi, Sung-Hoon Choa
Publikováno v:
Micromachines, Vol 14, Iss 3, p 601 (2023)
The aim of this study was to develop a flexible package technology using laser-assisted bonding (LAB) technology and an anisotropic solder paste (ASP) material ultimately to reduce the bonding temperature and enhance the flexibility and reliability o
Externí odkaz:
https://doaj.org/article/3da9defe5bf1426b86b7b283d646fdb9
Publikováno v:
ETRI Journal, Vol 41, Iss 6, Pp 820-828 (2019)
A highly reliable conductive adhesive obtained by transient liquid‐phase sintering (TLPS) technologies is studied for use in high‐power device packaging. TLPS involves the low‐temperature reaction of a low‐melting metal or alloy with a high
Externí odkaz:
https://doaj.org/article/605d4511fb2f46ffba5dc08bbad6bfd5
Autor:
Wagno Alves Braganca, Yong‐Sung Eom, Keon‐Soo Jang, Seok Hwan Moon, Hyun‐Cheol Bae, Kwang‐Seong Choi
Publikováno v:
ETRI Journal, Vol 41, Iss 3, Pp 396-407 (2019)
Laser‐assisted bonding (LAB) is an advanced technology in which a homogenized laser beam is selectively applied to a chip. Previous researches have demonstrated the feasibility of using a single‐tier LAB process for 3D through‐silicon via (TSV)
Externí odkaz:
https://doaj.org/article/494ccda55dfd49e28787284036e67c51
Autor:
Gwang-Mun Choi, Ki-Seok Jang, Kwang-Seong Choi, Jiho Joo, Ho-Gyeong Yun, Chanmi Lee, Yong-Sung Eom
Publikováno v:
Polymers, Vol 13, Iss 6, p 957 (2021)
An epoxy-based solder paste (ESP) is a promising alternative to conventional solder pastes to improve the reliability of fine-pitch electrical joining because the epoxy encapsulates the solder joint. However, development of an appropriate epoxy formu
Externí odkaz:
https://doaj.org/article/c9e6c771182a43b7aa470eac88ba1649
Autor:
Jong-Pil Im, Jeong Hun Kim, Jae Woo Lee, Ji Yong Woo, Sol Yee Im, Yeriaron Kim, Yong-Sung Eom, Won Chul Choi, Jun Soo Kim, Seung Eon Moon
Publikováno v:
Energies, Vol 13, Iss 3, p 674 (2020)
In this paper, we present the results of a preliminary study on the self-powered autonomous wireless sensor node by using thermoelectric energy generator based on Silicon (Si) thermoelectric legs, energy management integrated circuit (EMIC), Radio Fr
Externí odkaz:
https://doaj.org/article/cd875f993a5e4ba482519d4821b229dc
Autor:
Yong‐Sung Eom, Gwang‐Mun Choi, Ki‐Seok Jang, Jiho Joo, Chan‐mi Lee, Jin‐Hyuk Oh, Seok‐Hwan Moon, Kwang‐Seong Choi
Publikováno v:
ETRI Journal.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::205df238abab753029e8fdb11f14ff07
https://doi.org/10.4218/etrij.2022-0471
https://doi.org/10.4218/etrij.2022-0471
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1dabb0f9ba63a083e5cb2059fc3bb575
https://doi.org/10.1109/estc55720.2022.9939437
https://doi.org/10.1109/estc55720.2022.9939437
Publikováno v:
Journal of Nanoscience and Nanotechnology. 21:2959-2968
This study explored the feasibility of a fast and uniform large-scale laser sintering method for sintering stretchable electrodes. A homogenized rectangular infrared (IR) laser with a wavelength of 980 nm was used in the sintering process. A highly s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::053a73291d898400412a4d75ce6df8f0
https://doi.org/10.1166/jnn.2021.19135
https://doi.org/10.1166/jnn.2021.19135