Zobrazeno 1 - 10
of 92
pro vyhledávání: '"Yoichi Taira"'
Autor:
Tymon Barwicz, Yoichi Taira
Publikováno v:
IEEE Photonics Journal, Vol 6, Iss 4, Pp 1-18 (2014)
The high cost and low scalability of interfacing standard optical fibers to nanophotonic waveguides hinder the deployment of silicon photonics. We propose a mechanically compliant low-cost interface with integrated polymer waveguides. Our concept pro
Externí odkaz:
https://doaj.org/article/474b1ae121bd4a7fbd1681affbbfd9d8
Autor:
Shotaro Takenobu, Richard Langlois, Tymon Barwicz, Bo Peng, Swetha Kamlapurkar, Sebastian Engelmann, Paul Fortier, Nicolas Boyer, Alexander Janta-Polczynski, Yoichi Taira, Hidetoshi Numata, Katsuki Suematsu, Kengo Watanabe
Publikováno v:
IEEE Journal of Selected Topics in Quantum Electronics. 26:1-12
Interfacing standard optical fibers with high index-contrast photonic waveguides remains a substantial challenge restricting the cost-efficiency and scalability of silicon photonic devices. To address this, we have proposed a mechanically compliant p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::244ee3ec6352d13ecfd5daeec6fd6b35
https://doi.org/10.1109/jstqe.2020.2964383
https://doi.org/10.1109/jstqe.2020.2964383
Autor:
Yoichi Taira
Publikováno v:
2020 Pan Pacific Microelectronics Symposium (Pan Pacific).
Recent advancement of information and communication technology requires high-bandwidth data transmission. Signal transmission using optical fibers is widely used because of its extremely large signal bandwidth and length product. Since the signals in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aefe0674c767481ea5d86ceb0b642759
https://doi.org/10.23919/panpacific48324.2020.9059547
https://doi.org/10.23919/panpacific48324.2020.9059547
Autor:
Yves Martin, Nicolas Boyer, Alexander Janta-Polczynski, Ted Lichoulas, Paul Fortier, Eddie Kimbrell, Tymon Barwicz, Darrell Childers, Yoichi Taira, Bo Peng, Jae-Woong Nah, Elaine Cyr, Swetha Kamlapurkar, Hidetoshi Numata, Marwan H. Khater, Shotaro Takenobu, Robert K. Leidy, Sebastian Engelmann
Publikováno v:
Optical Fiber Technology. 44:24-35
Silicon photonics can enable optical circuits of unprecedented complexity and cost efficiency. It employs lithography to effectively pre-assemble optical devices on wafers fabricated in existing microelectronic facilities with decades of cost and rel
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6d68a20c7e02dd860a41ab5287aac1c3
https://doi.org/10.1016/j.yofte.2018.02.019
https://doi.org/10.1016/j.yofte.2018.02.019
Autor:
Yoichi Taira
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 20:302-307
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ba0b9cafc53983e9cae391918d7f29b
https://doi.org/10.5104/jiep.20.302
https://doi.org/10.5104/jiep.20.302
Autor:
Paul Fortier, Yoichi Taira, Alexander Janta-Polczynski, Richard Langlois, Elaine Cyr, Nicolas Boyer, Tymon Barwicz
Publikováno v:
Optical Interconnects XIX.
Single-mode integrated photonics assembly is challenging due to the tight alignment required for optical connections. To address this, we have developed a parallelized fiber assembly process using self-alignment of fiber arrays in V-grooves defined o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::027052ea8a1221d009bdd5543bb4306e
https://doi.org/10.1117/12.2514966
https://doi.org/10.1117/12.2514966
Autor:
Karin Hayashi1 karin@med.toho-u.ac.jp, Yoichi Taira1, Takamitsu Maeda1, Yumie Matsuda1, Yuki Kato1, Kozue Hashi1, Nobuo Kuroki1, Shuichi Katsuragawa1
Publikováno v:
BioPsychoSocial Medicine. 10/18/2016, Vol. 10, p1-6. 6p.
Autor:
Yves Martin, Nicolas Boyer, Shotaro Takenobu, Yurii A. Vlasov, Ted Lichoulas, Paul Fortier, Tymon Barwicz, Hidetoshi Numata, Marwan H. Khater, Alexander Janta-Polczynski, Jae-Woong Nah, Robert K. Leidy, Eddie Kimbrell, Swetha Kamlapurkar, Sebastian Engelmann, Yoichi Taira
Publikováno v:
IEEE Journal of Selected Topics in Quantum Electronics. 22:455-466
Silicon photonics leverages microelectronic fabrication facilities to achieve photonic circuits of unprecedented complexity and cost efficiency. This efficiency does not yet translate to optical packaging, however, which has not evolved substantially
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::84bb72d8c04c34302af693baaaedaa41
https://doi.org/10.1109/jstqe.2016.2593637
https://doi.org/10.1109/jstqe.2016.2593637
Autor:
Shotaro Takenobu, Nathalie Normand, Hidetoshi Numata, Bo Peng, Swetha Kamlapurkar, Katsuki Suematsu, Tymon Barwicz, Kengo Watanabe, Sebastian Engelmann, Yoichi Taira, Nicolas Boyer, Richard Langlois, Alexander Janta-Polczynski
Publikováno v:
2018 IEEE Photonics Conference (IPC).
We demonstrate a mechanically-compliant polymer interface, between standard fiber cables and nanophotonic waveguides, with passive self-alignment at both the fiber and the chip connections. We show a peak transmission of −1.8dB with less than 0.7dB
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9e087bb14d4b64858ab1c2fe4c8782dc
https://doi.org/10.1109/ipcon.2018.8527162
https://doi.org/10.1109/ipcon.2018.8527162
Autor:
Elaine Cyr, Yoichi Taira, Nicolas Boyer, Paul Fortier, Richard Langlois, Alexander Janta-Polczynski, Tymon Barwicz
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Cost-efficient packaging of silicon photonic chips is a key challenge to large scale deployment of silicon photonic devices. We have previously demonstrated a parallelized fiber-to-chip assembly process making use of off-the-shelf fiber components an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a68760628c2da0a70a06d79b0f1187b6
https://doi.org/10.1109/ectc.2018.00170
https://doi.org/10.1109/ectc.2018.00170