Screening of ALD thin films for Cu diffusion barrier applications

Autor: Puurunen, Riikka L., Salonen, Jaakko, Nurmela, Arto, Ylivaara, Oili, Viljanen, Heikki, Molarius, Jyrki, Monnoyer, Philippe, Yliniemi, Sanna, Pudas, Marko, Lehto, Tero, Li, Wei-Min

Publikováno v: Puurunen, R L, Salonen, J, Nurmela, A, Ylivaara, O, Viljanen, H, Molarius, J, Monnoyer, P, Yliniemi, S, Pudas, M, Lehto, T, Lehto, T & Li, W-M 2013, Screening of ALD thin films for Cu diffusion barrier applications . in Technical Program & Abstracts . American Vacuum Society (AVS), 13th International Conference on Atomic Layer Deposition, ALD 2013, San Diego, California, United States, 28/07/13 .

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=355e65625b88::f09fb2d8bd9cd053f6aacaf7f3942f60
https://cris.vtt.fi/en/publications/472ead77-ec2b-43af-ac39-3cea7c8f0350

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