Výsledky vyhledávání - "Yitzchak S. Rosen"

Effect of Carboxylic Acids on Reactive Transfer Printing of Copper Formate Ink

Autor: Yitzchak S. Rosen, Shlomo Magdassi

Publikováno v: MRS Advances. 3:261-267

During decomposition of copper formate, a volatile intermediate is formed, that can be utilized to fabricate conductive copper lines for electrical interconnections. By the method called Reactive Transfer Printing (RTP), a pattern of copper (II) form

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::faf80ea116beda9a61888c0dde4fab53
https://doi.org/10.1557/adv.2018.21

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Continuous Nanoparticle Assembly by a Modulated Photo-Induced Microbubble for Fabrication of Micrometric Conductive Patterns

Autor: Michael Layani, Ehud Greenberg, Shlomo Magdassi, Yitzchak S. Rosen, Hagay Shpaisman, Nina Armon

Publikováno v: ACS Applied Materials & Interfaces. 9:44214-44221

The laser-induced microbubble technique (LIMBT) has recently been developed for micro-patterning of various materials. In this method, a laser beam is focused on a dispersion of nanoparticles leading to the formation of a microbubble due to laser hea

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::16ee3d27d81cdac180df92129b95010c
https://doi.org/10.1021/acsami.7b14614

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Self-Reducing Copper Precursor Inks and Photonic Additive Yield Conductive Patterns under Intense Pulsed Light

Autor: Alexey Yakushenko, Yitzchak S. Rosen, Andreas Offenhäusser, Shlomo Magdassi

Publikováno v: ACS Omega
ACS Omega, Vol 2, Iss 2, Pp 573-581 (2017)
ACS omega 2(2), 573-581 (2017). doi:10.1021/acsomega.6b00478

Printing conducting copper interconnections on plastic substrates is of growing interest in the field of printed electronics. Photonic curing of copper inks with intense pulsed light (IPL) is a promising process as it is very fast and thus can be inc

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5e3bdc57af1e2371d218b0e707256073
http://europepmc.org/articles/PMC6641306

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Thin Copper Flakes for Conductive Inks Prepared by Decomposition of Copper Formate and Ultrafine Wet Milling

Autor: Yitzchak S. Rosen, Vitaly Gutkin, Shlomo Magdassi, Roy Marrach

Publikováno v: Advanced Materials Technologies. 4:1800426

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::a623f17b18d6331382e376a567dbe09f
https://doi.org/10.1002/admt.201800426

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Printed Electronics: Printing a Self-Reducing Copper Precursor on 2D and 3D Objects to Yield Copper Patterns with 50% Copper's Bulk Conductivity (Adv. Mater. Interfaces 3/2015)

Autor: Michael Grouchko, Yitzchak S. Rosen, Shlomo Magdassi

Publikováno v: Advanced Materials Interfaces. 2

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::23849d8fae021bca35fabd82977f0ea1
https://doi.org/10.1002/admi.201570014

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Copper interconnections and antennas fabricated by hot-pressing printed copper formate

Autor: Revital Balter, Asad Awadallah, Yosi Shacham-Diamand, Yitzchak S. Rosen, Yuval Lidor, Shlomo Magdassi, Adi Szeskin

Publikováno v: Flexible and Printed Electronics. 2:035007

We present a novel process to fabricate conductive patterns by a new copper precursor ink. In this method, an ink with copper formate, a self-reducible copper precursor, is printed, and subsequently heated under high pressure in a hot-press, which is

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::6ad70ad3c10a5314897c7a442bc07553
https://doi.org/10.1088/2058-8585/aa89bb

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