Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Yipeng Cui"'
Autor:
Lin Niu, Zehao Zha, Haoran Yang, Jie Ma, Qinghao He, Yanan Wang, Yipeng Cui, Xiang Li, Duanyang Geng
Publikováno v:
Agriculture, Vol 14, Iss 6, p 836 (2024)
In order to solve the problem of the high damage rate of corn with a high moisture content in the Huanghuaihai region, according to the mechanical characteristics of corn in the Huanghuaihai region, we designed a flexible threshing device with a thre
Externí odkaz:
https://doaj.org/article/1bffd6b3d75e49288a37d68fa355eb17
Autor:
Jiarui Ming, Qinghao He, Dong Yue, Jie Ma, Yanan Wang, Jianning Yin, Yipeng Cui, Duanyang Geng
Publikováno v:
Agriculture, Vol 14, Iss 5, p 731 (2024)
Aiming at the problems of uneven distribution of dislodged material on the screen surface of longitudinal axial flow grain combine harvester, a large difference in material clearing time, and large clearing loss, a dislodged material homogenizing dev
Externí odkaz:
https://doaj.org/article/2d3cf8d2c9e2411cae6cd0df2d91285c
PurposeTo determine the feasibility and diagnostic value of percutaneous ultrasound-guided subacromial bursography (PUSB) in the diagnosis of rotator cuff tears.MethodsBetween July 2019 to October 2021, 78 patients who had suspected rotator cuff inju
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6271d30aba284f225041bf4a52fc49fd
https://doi.org/10.21203/rs.3.rs-1463998/v2
https://doi.org/10.21203/rs.3.rs-1463998/v2
Publikováno v:
Ninth International Conference on Graphic and Image Processing (ICGIP 2017).
Publikováno v:
Medical Ultrasonography. 2023, Vol. 25 Issue 1, p48-55. 8p.
Publikováno v:
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
The interfacial reactions between (001) Ni single crystal and high-Sn solders were compared with those of polycrystalline Ni. The morphology of interfacial intermetallic compound (IMC) grains formed between (001) Ni single crystal and high-Sn solders
Autor:
Mingliang Huang, Yipeng Cui
Publikováno v:
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
This work compared the interfacial reactions of single crystal Cu and polycrystalline Cu with the high-Sn solders. The morphology aspects of Cu 6 Sn 5 intermetallic compound (IMC) grains formed between (001) single crystal Cu and high-Sn solder bath
Publikováno v:
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP); 2010, p293-298, 6p
Autor:
Yipeng Cui, Mingliang Huang
Publikováno v:
2009 International Conference on Electronic Packaging Technology & High Density Packaging; 2009, p593-596, 4p
Autor:
Ruochen Li1, Han Xue1, Zheyue Zhu1, Guangwei Wu1, Yipeng Cui2, Chen Zhang1, Miao Li2 15229292852@163.com
Publikováno v:
Medical Ultrasonography. 2023, Vol. 25 Issue 4, p390-397. 8p.