Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Yingzhuo Huang"'
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c9dd92d6d6ea47b58155ef199b9e2ac
https://doi.org/10.1109/icept56209.2022.9873278
https://doi.org/10.1109/icept56209.2022.9873278
Autor:
Mengke Tian, Hengliang Zhu, Yong Wang, Yimao Cai, Feng Liu, Pengrong Lin, Yingzhuo Huang, Xiaochen Xie
Publikováno v:
Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering ISBN: 9783031243851
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::48ef6e2def68289bf035ac75a2ebf883
https://doi.org/10.1007/978-3-031-24386-8_26
https://doi.org/10.1007/978-3-031-24386-8_26
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e827df51eeb6ae8d80e620200517dd9d
https://doi.org/10.1109/eptc53413.2021.9663895
https://doi.org/10.1109/eptc53413.2021.9663895
Publikováno v:
Journal of Physics: Conference Series. 2383:012093
A novel packaging designing for high density and high voltage power module, namely TPak was proposed. It uses flip-chip welding technology and through-hole technology to avoid the parasitic parameters introduced by wire bonding in traditional electri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5fcf5faa5426631280a605b0f1a6447d
https://doi.org/10.1088/1742-6596/2383/1/012093
https://doi.org/10.1088/1742-6596/2383/1/012093
Autor:
Wei Duan, Juanjuan Han, Yingzhuo Huang, Feng-Huei Lin, Qinqin Xue, Yan Duan, Yingchun Hou, Xiaojie Gao, Qian Wang, Guochao Nie
Publikováno v:
Molecular and cellular probes. 30(3)
Targeting peptide has been considered to be useful as a small molecule probe leading to multifunctional properties for both imaging detection and targeting therapy. Thus, the identification of novel targets is urgently needed to develop innovative ag
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::75c73529d6b63e77ae1da818e3b9c6b7
https://pubmed.ncbi.nlm.nih.gov/26808386
https://pubmed.ncbi.nlm.nih.gov/26808386
Publikováno v:
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
Al/Cu joint was widely used in the industries, such as refrigerator, cable, air condition and CPU radiator etc. Sn-9Zn-XNi lead-free solders were used to join Al and Cu in this study. Tiny Zn and coarsened Ni 5 Zn 21 phases distributed in the Sn matr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b6d84e2094bee4d74d8fcb294af96ae1
https://doi.org/10.1109/icept.2010.5582876
https://doi.org/10.1109/icept.2010.5582876
Publikováno v:
International Symposium on Advanced Packaging Materials (APM), 2011; 2011, p145-148, 4p