Zobrazeno 1 - 10
of 26
pro vyhledávání: '"Yingxin Goh"'
Publikováno v:
Journal of Materials Research and Technology, Vol 29, Iss , Pp 2376-2395 (2024)
Cracks in concrete structures can significantly decrease their lifespan by exposing reinforcement to outside environment, leading to concrete degradation. To address this issue, self-healing techniques have been developed, including biomineralization
Externí odkaz:
https://doaj.org/article/ee8760ad028d437fb20bdc098151beaa
Autor:
Mutaz K. Chahrour, Md. Akter Hosen, Yingxin Goh, Teong Yen Tong, Soon Poh Yap, Mohamed Amine Khadimallah
Publikováno v:
Advances in Materials Science and Engineering, Vol 2021 (2021)
Bamboo is deemed an emerging constructional material with promising application projections due to the reliable natural properties and advantageous structural characteristics. However, there is a lack of systematic studies on the mechanical character
Externí odkaz:
https://doaj.org/article/99510e93f5374402b242c24984201860
Publikováno v:
Materials Today: Proceedings.
Autor:
Looi Sing Soong, Michael Yong Jing Liu, Soon Poh Yap, Kim Hung Mo, Mohd Zamin Jumaat, Yingxin Goh
Publikováno v:
Arabian Journal for Science and Engineering. 47:12289-12299
Publikováno v:
Journal of Materials Science: Materials in Electronics. 34
Publikováno v:
Journal of Materials Science: Materials in Electronics. 32:9490-9499
The properties of the intermetallic compounds (IMCs) formed at the interface between the solder and the Under Bump Metallization (UBM) are crucial for the reliability of solder joints. Cobalt (Co) is a potential candidate for UBM since it can act as
Autor:
Yingxin Goh, Hussein Adebayo Ibrahim, Wan Xien Goh, Soon Poh Yap, Michael Yong Jing Liu, Kim Hung Mo
Publikováno v:
European Journal of Environmental and Civil Engineering. 26:1792-1806
This article presents the investigation on mechanical and transport properties of polypropylene (PP) fibre reinforced cement composites with varying fibre volume (0.05–0.30%). Fresh property of the...
Publikováno v:
Journal of Materials Science: Materials in Electronics. 31:4554-4562
Transient liquid phase (TLP) bonding has gained attention due to the advantage of producing bond that has a higher melting point than the bonding temperature. Cobalt (Co) is a potential candidate for base metal in TLP bond. This work studied the inte
Publikováno v:
Journal of Building Engineering. 63:105392