Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Yingqiong Bu"'
Autor:
Shiqiang Zheng, Zhilin Zheng, Hongmei Liu, Weihua Cao, Xin Wang, Jiajun Zhang, Jun Zhang, Yingqiong Bu, Xingping Ruan, Qing Qiao
Publikováno v:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f41930924c8f9c08e5fb6cc097c83f7a
https://doi.org/10.1109/itherm54085.2022.9899598
https://doi.org/10.1109/itherm54085.2022.9899598
Autor:
Guofeng Chen, Nishi Ahuja, Qing Qiao, Qingming Fu, Jun Zhang, Jing Liu, Sun Ruiyu, Yingqiong Bu, Li Yongwei
Publikováno v:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
As data explosion dramatically accelerating from IoT (Internet of Thing) edge devices, high performance server has been dominating deployment in the recent CSPs (Cloud Service Providers) data center for conquering the challenge of huge amount of data
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1530b3d80250a0730e7705391adedab4
https://doi.org/10.1109/itherm51669.2021.9503148
https://doi.org/10.1109/itherm51669.2021.9503148
Autor:
Craig S Cauvel, Damm Drew G, Andrew C Dausman, Joshua T Linden Levy, Anupama Balasubramanian, Sam Melhem, Brian Mao, Yingqiong Bu
Publikováno v:
ISSE
In an environment where the most power and performance is needed at the least cost, engineering is always looking at how to optimize existing hardware features. This is done through system engineering solutions and optimized software. This paper will
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::62b1af8fa44b7825398c22dbf6b1a6a7
https://doi.org/10.1109/isse46696.2019.8984490
https://doi.org/10.1109/isse46696.2019.8984490