Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Yingfeng Wen"'
Autor:
Shuaishuai Zhu, Maoji Zhao, Hongru Zhou, Yingfeng Wen, Yong Wang, Yonggui Liao, Xingping Zhou, Xiaolin Xie
Publikováno v:
Nature Communications, Vol 14, Iss 1, Pp 1-9 (2023)
Switchable catalysis promises exceptional efficiency in synthesizing polymers with increasing structural complexity but current achievements in such attempts are limited to constructing linear block copolymers. Here the authors report a visible light
Externí odkaz:
https://doaj.org/article/0e6b549ef1194093b1d05e069415bd6e
Autor:
Yi Chen, Philip Mickel, Huijie Pei, Yingfeng Wen, Xin Guan, Yun Wang, Xuyang Wang, Omar Al Mhtachem, Cheng Zhang, Hui Nie, Xingping Zhou, Petr Kral, Xiaolin Xie
Publikováno v:
ACS Applied Materials & Interfaces. 15:18333-18342
Publikováno v:
Chinese Journal of Polymer Science. 40:47-55
Supramolecular adhesives that enable debonding on-demand are of significant research interest for the development of adaptive and smart materials, yet, biodegrable supramolecular adhesives have been rarely exploited. Herein, telechelic, three-armed a
Autor:
Shuaishuai Zhu, Maoji Zhao, Hongru Zhou, Yingfeng Wen, Yong Wang, Yonggui Liao, Xingping Zhou, Xiaolin Xie
Switchable catalysis promises exceptional efficiency in synthesizing polymers with ever-increasing structural complexity. However, current achievements in such attempts are limited to constructing linear block copolymers. Here we report a visible lig
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::421c846b0de33e9e83706ad3ddfcdc91
https://doi.org/10.21203/rs.3.rs-2192837/v1
https://doi.org/10.21203/rs.3.rs-2192837/v1
Publikováno v:
Folia Neuropathologica, Vol 62, Iss 2, Pp 171-186 (2024)
Externí odkaz:
https://doaj.org/article/c3b486289f9c4b1ab3097b2ab28f35a2
Autor:
Yingfeng Wen, Chao Chen, Yunsheng Ye, Zhigang Xue, Hongyuan Liu, Xingping Zhou, Yun Zhang, Dequn Li, Xiaolin Xie, Yiu‐Wing Mai
Publikováno v:
Advanced materials (Deerfield Beach, Fla.). 34(52)
The integrated circuits industry has been continuously producing microelectronic components with ever higher integration level, packaging density, and power density, which demand more stringent requirements for heat dissipation. Electronic packaging
Autor:
Hu Yang, Zhigang Xue, Xiaolin Xie, Yingfeng Wen, Xingping Zhou, Guohua Hu, Dean Shi, Chao Chen
Publikováno v:
Composites Science and Technology
Composites Science and Technology, Elsevier, 2021, 209, pp.108760. ⟨10.1016/j.compscitech.2021.108760⟩
Composites Science and Technology, Elsevier, 2021, 209, pp.108760. ⟨10.1016/j.compscitech.2021.108760⟩
Epoxy (EP) composites with comprehensive good processability, low coefficient of thermal expansion (CTE), and high thermal conductivity, but electrical insulation properties are largely demanded in the higher power electric devices. However, micro-fi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::43263b0e93d70c573668a22e6a4367bd
https://hal.univ-lorraine.fr/hal-03504121
https://hal.univ-lorraine.fr/hal-03504121
Autor:
Dean Shi, Zhigang Xue, Yingfeng Wen, Xiaolin Xie, Jinwei Liu, Xiongwei Li, Li Xiaojing, Chao Chen
Publikováno v:
Composites Communications. 15:46-52
Carbon nanotubes (CNTs) reinforced polymer composites are highly desirable as ideal candidates of light-weighting structural and multifunctional materials due to their potential to combine the superior performance of individual constituents. However,
Autor:
Xiongwei Li, Zhi Li, Yang Xue, Dean Shi, Zhigang Xue, Li Xiaojing, Xiaolin Xie, Fan Wu, Yingfeng Wen, Chao Chen
Publikováno v:
Chemical Engineering Journal. 369:1150-1160
Polymer-based thermal conductive composites (PTCs) with good thermal and mechanical properties are highly appreciated in the thermal management of modern electronic devices. However, the heat transfer property of particle-filled PTCs is severely limi
Autor:
Yang Xue, Zhigang Xue, Yiu-Wing Mai, Xiaolin Xie, Chao Chen, Xiongwei Li, Xingping Zhou, Yingfeng Wen, Dean Shi, Jinwei Liu
Publikováno v:
Composites Part A: Applied Science and Manufacturing. 118:67-74
In this study, epoxy (EP)/binary spherical alumina (S-Al2O3) composites with a high loading of 50 vol% were fabricated by incorporating different sizes of S-Al2O3 into EP to increase the thermal conductivity and yet retain the flowability of the comp