Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Yingchao Wei"'
Autor:
Chengjun Li, Yubo Luo, Wang Li, Boyu Yang, Chengwei Sun, Wenyuan Ma, Zheng Ma, Yingchao Wei, Xin Li, Junyou Yang
Publikováno v:
Chip, Vol 3, Iss 2, Pp 100096- (2024)
With the development of 5G technology and increasing chip integration, traditional active cooling methods struggle to meet the growing thermal demands of chips. Thermoelectric coolers (TECs) have garnered great attention due to their rapid response,
Externí odkaz:
https://doaj.org/article/4be790a74f8c4bb7a8a09c313bd19012
Autor:
Zheng Ma, Yubo Luo, Wang Li, Tian Xu, Yingchao Wei, Chengjun Li, Abubakar Yakubu Haruna, Qinghui Jiang, Dan Zhang, Junyou Yang
Publikováno v:
Chemistry of Materials. 34:8959-8967
Autor:
Wang Li, Yubo Luo, Tian Xu, Zheng Ma, Chengjun Li, Yingchao Wei, Yang Tao, Yongxin Qian, Xin Li, Qinghui Jiang, Junyou Yang
Publikováno v:
Small.
Autor:
Junyou Yang, Zheng Ma, Yubo Luo, Li Wang, Yingchao Wei, Chengjun Li, Yakubu Haruna Abubakar, Zhihong Zhang, Xin Li, Qinghui Jiang
Publikováno v:
Journal of Materials Chemistry A.
Point defects play an import role in regulating the electrical and thermal transport properties of thermoelectric materials, but it always restricted by the solubility of dopant in the matrix. Herein,...
Publikováno v:
2022 34th Chinese Control and Decision Conference (CCDC).