Zobrazeno 1 - 10
of 64
pro vyhledávání: '"Ying-Wei Lu"'
Autor:
Ying-Ying Yang, Wen-Tao Zhou, Wei-Long Song, Qing-Quan Zhu, Hao-Jiang Xiong, Yu Zhang, Sheng Cheng, Pai-Feng Luo, Ying-Wei Lu
Publikováno v:
Nanoscale Research Letters, Vol 16, Iss 1, Pp 1-7 (2021)
Abstract Both multilayered (ML) and few-layered (FL) Ti3C2Tx nanosheets have been prepared through a typical etching and delaminating procedure. Various characterizations confirm that the dominant terminal groups on ML-Ti3C2Tx and FL-Ti3C2Tx are diff
Externí odkaz:
https://doaj.org/article/e882b172e47e4cf28ffc07f39a05811d
Autor:
Ying-Wei Lu, Jia Sun, Xu Chenqiang, Wang Haisheng, Zhang Yewei, Luo Paifeng, Fei Ding, Juntao Hu, Chao Zhang
Publikováno v:
ACS Applied Energy Materials. 4:5543-5553
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::be3df9925664c2b3402368c9ff03d431
https://doi.org/10.1021/acsaem.1c00226
https://doi.org/10.1021/acsaem.1c00226
Autor:
Yu Po Wang, Andrew Kang, Ying Wei Lu, Don Son Jiang, Pai Yu Cheng, Teny Shih, Po Yuan Su, David Lai
Publikováno v:
ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
From the fifth-generation (5G) of system architecture evolution, there are more and more demands which require high data rate communication, low latency, and massive connectivity for network data transmission. For millimeter-wave (mm-wave), communica
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e640078e9853823efba88cd9f8515a05
https://doi.org/10.1115/ipack2020-2507
https://doi.org/10.1115/ipack2020-2507
Autor:
Ying-Ying Yang, Wen-Tao Zhou, Wei-Long Song, Qing-Quan Zhu, Hao-Jiang Xiong, Jue Zhang, Sheng Cheng, Pai-Feng Luo, Ying-Wei Lu
Both multilayered (ML) and few-layered (FL) Ti3C2Tx nanosheets with different dominant terminal groups have been prepared through a typical etching and delaminating procedure. Various characterizations confirm that the physical and chemical performan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15394081a4579101ec9e97201d88d2bd
https://doi.org/10.21203/rs.3.rs-73130/v1
https://doi.org/10.21203/rs.3.rs-73130/v1
Autor:
Ying-Ying, Yang, Wen-Tao, Zhou, Wei-Long, Song, Qing-Quan, Zhu, Hao-Jiang, Xiong, Yu, Zhang, Sheng, Cheng, Pai-Feng, Luo, Ying-Wei, Lu
Publikováno v:
Nanoscale Research Letters
Both multilayered (ML) and few-layered (FL) Ti3C2Tx nanosheets have been prepared through a typical etching and delaminating procedure. Various characterizations confirm that the dominant terminal groups on ML-Ti3C2Tx and FL-Ti3C2Tx are different, wh
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::e7341a5b76dbaff4b35c2f528822bc7b
https://pubmed.ncbi.nlm.nih.gov/33846860
https://pubmed.ncbi.nlm.nih.gov/33846860
Publikováno v:
Israelsen, N M, Lu, Y-W, Andersen, U L & Huck, A 2020, ' Coupling colloidal quantum dots to a dielectric slot-waveguide ', Journal of Physics Communications, vol. 4, no. 8, 085003 . https://doi.org/10.1088/2399-6528/abaacb
The coupling between single photon emitters and integrated photonic circuits is an emerging topic relevant for quantum information science and other nanophotonic applications. We investigate the coupling between a hybrid system of colloidal quantum d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cbbc9d49d3121e63b3f511c287c7ae8f
https://orbit.dtu.dk/en/publications/2f355155-35dd-4eeb-a050-cb3d55e36c35
https://orbit.dtu.dk/en/publications/2f355155-35dd-4eeb-a050-cb3d55e36c35
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
The design of the millimeter wave antenna in package (AiP) or antenna in module (AiM) makes testing over the air a must. Because of the long test time and the use of the anechoic chambers, a high-efficiency parallel measurement must be performed in m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::90b511757170a85bbffbd88cd50cd9ea
https://doi.org/10.1109/eptc47984.2019.9026630
https://doi.org/10.1109/eptc47984.2019.9026630
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
In order to develop suitable antenna configurations for mmWave band, the selection of the substrate material and the stack-up are also a quite indispensable topic that affects antenna characteristics and the workability. This study focuses on the des
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ab0b577a0fc087b5832296a0ad4b3954
https://doi.org/10.1109/eptc47984.2019.9026649
https://doi.org/10.1109/eptc47984.2019.9026649
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
It is usual to measure the characteristic impedance of the transmission line in the factory by the time-domain reflectometer (TDR) with the test fixture, but the insertion loss of the test fixture would raise the measurement error, especially when th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9027cc9b922633fcd36d0580dd8bf812
https://doi.org/10.1109/ectc.2019.00261
https://doi.org/10.1109/ectc.2019.00261
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
In order to cope with the worldwide shortage of the MLCC (multilayer ceramic capacitor), this paper proposes a methodology of integrated lattice balun using a high permittivity substrate material. It is well known that discrete radio frequency (RF) f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::90bf71a38162c4c17ff0c6e818abf5fe
https://doi.org/10.1109/eptc.2018.8654314
https://doi.org/10.1109/eptc.2018.8654314