Zobrazeno 1 - 10
of 83
pro vyhledávání: '"Ying-Ta Chiu"'
Autor:
Ying-Ta Chiu, 邱盈達
93
This study investigated the bonding behavior between Sn-Zn series lead-free solder and substrate. The bonding strength of the solder ball was measured by shear and pull test. The BGA package was connected to the OSP/Cu print circuit board. Af
This study investigated the bonding behavior between Sn-Zn series lead-free solder and substrate. The bonding strength of the solder ball was measured by shear and pull test. The BGA package was connected to the OSP/Cu print circuit board. Af
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/57017888324922554929
Autor:
Ying-Ta Chiu, 邱盈達
92
Objective of this study is to reduce the point and non-point sources pollution to improve the eutrophication of Mu-Tan Reservoir through planning of constructed wetlands in the watershed. Investigation of the point-source pollutants was condu
Objective of this study is to reduce the point and non-point sources pollution to improve the eutrophication of Mu-Tan Reservoir through planning of constructed wetlands in the watershed. Investigation of the point-source pollutants was condu
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/62254955586771612182
Publikováno v:
Journal of Materials Science: Materials in Electronics. 29:14144-14150
An innovative and efficient surface modification pre-treatment that enhances Cu–Cu direct bonding through electromagnetic irradiation, including pulsed Xenon flash and near infrared rays is proposed. Without vacuum, short but critical electromagnet
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::561247f64dc559cace10c85481c8a52f
https://doi.org/10.1007/s10854-018-9547-5
https://doi.org/10.1007/s10854-018-9547-5
Publikováno v:
ECS Journal of Solid State Science and Technology. 7:P109-P113
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d7740be69eeafeea04e286bfba23eeb7
https://doi.org/10.1149/2.0121803jss
https://doi.org/10.1149/2.0121803jss
Publikováno v:
Intermetallics. 85:117-124
Electromigration will induce polarity effects on the formation and dissolution of intermetallic compounds (IMCs) at the electrodes in conventional solder joints. However, the entire solder joint of a microbump may convert to intermetallic compounds a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::880849ef82cb862383a7fcb2ed8147f3
https://doi.org/10.1016/j.intermet.2017.02.012
https://doi.org/10.1016/j.intermet.2017.02.012
Publikováno v:
Materials Letters. 160:309-313
This study investigated the electro-dissolution, supersaturation and recrystallization of the second phase Bi in the Sn5Bi solder under 4.0×10 3 –6.0×10 3 A/cm 2 current stressing at 25 °C. The ex-situ XRD analysis of the current stressed specim
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a3e771d95f78a4b9e5153633331bf2e2
https://doi.org/10.1016/j.matlet.2015.07.131
https://doi.org/10.1016/j.matlet.2015.07.131
Autor:
David Tarng, Ying-Ta Chiu, Yi-You Yu, Chih-Pin Hung, Shang-Kun Huang, Sin-Yong Liang, Jenn-Ming Song
Publikováno v:
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
An innovative pre-treatment to enhance metallic bonding through the exposure of electromagnetic radiations including flash light and near infrared rays was proposed in this study. Short period of electromagnetic radiation exposures including near inf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a9f4e4ff20ec09f432b2c3160fdb0a12
https://doi.org/10.23919/icep.2018.8374303
https://doi.org/10.23919/icep.2018.8374303
Publikováno v:
2017 IEEE CPMT Symposium Japan (ICSJ).
Cu to Cu bonding technology of IC package has the potential to replace solder joint in Future trends. The Cu to Cu bonding technology compared with other joint methods for IC package, it can solve the reliability problems such as electromigration, br
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d760b55bfc9ede5dd4c696419da563db
https://doi.org/10.1109/icsj.2017.8240133
https://doi.org/10.1109/icsj.2017.8240133
Autor:
Sin-Yong Liang, Ying-Ta Chiu, David Tarng, Chih-Pin Hung, Po-Hao Chiang, Shang-Kun Huang, Jenn-Ming Song
Publikováno v:
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
An innovative pre-treatment to enhance Cu-to-Cu bonding through the exposure of electromagnetic radiations including flash light and near infrared rays is first proposed in this study. Short period of electromagnetic radiation exposure can significan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::216647f0b8392fb8fbd38415443a4540
https://doi.org/10.23919/ltb-3d.2017.7947439
https://doi.org/10.23919/ltb-3d.2017.7947439
Autor:
Jenn-Ming Song, Chih-Pin Hung, Sin-Yong Liang, Ying-Ta Chiu, Zong-Yu Xie, Po-Hao Chiang, Shang-Kun Huang, David Tarng
Publikováno v:
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
Cu-to-Cu direct bonding is one of the key technologies for 3D (three-dimensional) chip stacking. This research proposes a new concept to enhance Cu-Cu direct bonding through the control of residual stresses on bonding surface. Compressive residual st
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b57ed688a040606272befe736a6db6a1
https://doi.org/10.23919/ltb-3d.2017.7947467
https://doi.org/10.23919/ltb-3d.2017.7947467