Zobrazeno 1 - 10
of 33
pro vyhledávání: '"Ying-Ching Shih"'
Autor:
Ying-Ching Shih, 施儀晶
96
In the present tough business environment, many airlines utilize strategic alliances to be in a better position in such competitive pressures. Code-sharing is one of the marketing tools widely used by international airlines to expand their ne
In the present tough business environment, many airlines utilize strategic alliances to be in a better position in such competitive pressures. Code-sharing is one of the marketing tools widely used by international airlines to expand their ne
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/8dmwtx
Autor:
Ying-Ching Shih
Thesis (M.A.)--National Taiwan University Graduate Institute of Applied Mechanics
Non-Latin script record. Includes bibliographical references
Non-Latin script record. Includes bibliographical references
Autor:
Hsiang-Hung Chang, Kuo-Ning Chiang, C. W. Chiang, Y. H. Chen, Zhi-Cheng Hsiao, Ying-Ching Shih
Publikováno v:
2009 59th Electronic Components and Technology Conference.
In this study, bottom-up electroplating is used for TSV (Through Silicon via) fabrication. With the metal temporarily bonding technology, we could remove the handling substrate and perform the chip stacking process. The TSVs made by bottom-up electro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e63a062dbad67f412f3e54f7f97289ce
https://doi.org/10.1109/ectc.2009.5074161
https://doi.org/10.1109/ectc.2009.5074161
Autor:
Yin-Po Hung, Kuo-Chyuan Chen, Tzu-Ying Kuo, Yu-Hua Chen, Zhi-Cheng Hsiao, Ying-Ching Shih, Jui-Hsiung Huang, Jing-Yao Chang, Chao-Kai Hsu, Chih-Yuan Cheng, Ching-Kuan Lee, Cheng-Ta Ko
Publikováno v:
2009 59th Electronic Components and Technology Conference.
This paper discloses an ultra-thin and highly flexible package with embedded active chips. In this structure, there are no any supporting and permanent substrates needed. A 3um copper foil with 18um carrier layer was used as temporal substrate. The c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::de2fc8500fedceeffd06c2af611ffa1f
https://doi.org/10.1109/ectc.2009.5074201
https://doi.org/10.1109/ectc.2009.5074201
Autor:
Chia-Wen Chiang, Yu-Hua Chen, Shu-Man Li, Tzu-Ying Kuo, Ying-Ching Shih, Yu-Jiau Hwang, Cheng-Ta Ko, Zhi-Cheng Hsiao, Hsiang-Hung Chang, Yuan-Chang Lee
Publikováno v:
2009 59th Electronic Components and Technology Conference.
An ultra-thin, flexible package was successfully demonstrated in this paper. The integration of semiconductor chip and flexible substrate, development of ultra-thin chip technology, and embedded chip technology are the key topics. For the purpose of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::23f586276a927eeebfbceb7088308784
https://doi.org/10.1109/ectc.2009.5074252
https://doi.org/10.1109/ectc.2009.5074252
Autor:
Zhi-Cheng Hsiao, Kuo-Ning Chiang, Hsiang-Hung Chang, C.W. Chiang, C.K. Hsu, Ying-Ching Shih, Yu-Hua Chen
Publikováno v:
2008 2nd Electronics Systemintegration Technology Conference.
TSV (through silicon via) is a core technology in 3D IC package. The micro vias can be made by etching or laser drilling. Standard processes for TSV filling begin with seed layer deposition, followed by blind vias copper electroplating. If the aspect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0880d32171d877ff763ce54cfdc755ca
https://doi.org/10.1109/estc.2008.4684427
https://doi.org/10.1109/estc.2008.4684427
Autor:
Cheng-Ta Ko, Yu-Jiau Hwang, Kuo-Chyuan Chen, Yuan-Chang Lee, Zhi-Cheng Hsiao, Ying-Ching Shih, Yu-Hua Chen, Chih-Yuan Cheng, Huan-Chun Fu
Publikováno v:
2008 2nd Electronics Systemintegration Technology Conference.
Previously, the electronics devices are always integrated into a rigid substrate. Itpsilas stronger, but hardly compatible with Bio-tech or some implanted systems for human being whose packaging point should be more focusing on the flexibility or eve
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d587e97b31dd25be18f5c79d3f11eb7d
https://doi.org/10.1109/estc.2008.4684557
https://doi.org/10.1109/estc.2008.4684557
Autor:
Jing-Yao Chang, Yu-Hua Chen, Ying-Ching Shih, Tzu-Ying Kuo, Cheng-Ta Ko, A. Ostmann, Dionysios Manessis
Publikováno v:
2008 2nd Electronics Systemintegration Technology Conference.
This paper brings into light a new ultra-thin and highly flexible package with embedded active chips. In this technology, no supporting and permanent substrates were needed. Copper foil was used as temporal substrate, and it became the bottom circuit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dcc820543aaa4cedae8a0d16d2fda468
https://doi.org/10.1109/estc.2008.4684337
https://doi.org/10.1109/estc.2008.4684337
Autor:
Chao-Kai Hsu, Wei-Chung Lo, Chun-Te Lin, Chia-Wen Chiang, Ying-Ching Shih, Shu-Ming Chang, Yu-Hua Chen, Ching Kuan Lee, Tzu-Ying Kuo
Publikováno v:
2008 58th Electronic Components and Technology Conference.
In order to achieve the shorter circuit design of multiple chips, three-dimensional (3D) packaging technologies with through silicon vias were developed to achieve high performance, low power consumption and small packaging size. In this paper, a PCB
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1a8cb4a259750851615b82cf67d62b05
https://doi.org/10.1109/ectc.2008.4550076
https://doi.org/10.1109/ectc.2008.4550076