Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Ying Jun Mao"'
Publikováno v:
Advanced Materials Research. 254:107-110
This paper reports a process of filling and planarization of microstructures for MEMS and wafer level packaging application. In this work, cavities of 5-10mm depth and 20-100mm in length/width are filled using multiple coatings of polyimide with kine
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2c3ac573f3e1f82cc2f840724bcd7d80
https://doi.org/10.4028/www.scientific.net/amr.254.107
https://doi.org/10.4028/www.scientific.net/amr.254.107
Publikováno v:
Advanced Materials Research. 254:54-57
Various types of polyimide have been used widely in the manufacturing of integrated circuits and MEMS’ (Micro Electrical Mechanical Systems) such as sensors. These organic spin-on polymers exhibit a wide range of mechanical and electrical propertie
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b9e412e32fc40d8f15eebb72296e0640
https://doi.org/10.4028/www.scientific.net/amr.254.54
https://doi.org/10.4028/www.scientific.net/amr.254.54
Publikováno v:
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
Chemical Mechanical Polishing (CMP) on thinned bonded wafer is one of the key challenges in the entire via-last TSV process flow. This paper addresses the issue of oxide loss and barrier metal residue during CMP process. The impact of pre-CMP thermal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2890dfa266615022c7584f094bd2055
https://doi.org/10.1109/eptc.2015.7412401
https://doi.org/10.1109/eptc.2015.7412401
Publikováno v:
Lecture Notes in Electrical Engineering ISBN: 9789400776173
Based on the development of telemedicine in the United States and Europe, the article introduces the history and the present situation of telemedicine development. The current telemedicine mainly contains: tele-consultation, tele-diagnose, tele-educa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ee1a8048f91ccbf3eaa6494ce9fccd9
https://doi.org/10.1007/978-94-007-7618-0_420
https://doi.org/10.1007/978-94-007-7618-0_420
