Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Ying Jun Mao"'
Publikováno v:
Advanced Materials Research. 254:107-110
This paper reports a process of filling and planarization of microstructures for MEMS and wafer level packaging application. In this work, cavities of 5-10mm depth and 20-100mm in length/width are filled using multiple coatings of polyimide with kine
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2c3ac573f3e1f82cc2f840724bcd7d80
https://doi.org/10.4028/www.scientific.net/amr.254.107
https://doi.org/10.4028/www.scientific.net/amr.254.107
Publikováno v:
Advanced Materials Research. 254:54-57
Various types of polyimide have been used widely in the manufacturing of integrated circuits and MEMS’ (Micro Electrical Mechanical Systems) such as sensors. These organic spin-on polymers exhibit a wide range of mechanical and electrical propertie
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b9e412e32fc40d8f15eebb72296e0640
https://doi.org/10.4028/www.scientific.net/amr.254.54
https://doi.org/10.4028/www.scientific.net/amr.254.54
Publikováno v:
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
Chemical Mechanical Polishing (CMP) on thinned bonded wafer is one of the key challenges in the entire via-last TSV process flow. This paper addresses the issue of oxide loss and barrier metal residue during CMP process. The impact of pre-CMP thermal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2890dfa266615022c7584f094bd2055
https://doi.org/10.1109/eptc.2015.7412401
https://doi.org/10.1109/eptc.2015.7412401
Publikováno v:
Lecture Notes in Electrical Engineering ISBN: 9789400776173
Based on the development of telemedicine in the United States and Europe, the article introduces the history and the present situation of telemedicine development. The current telemedicine mainly contains: tele-consultation, tele-diagnose, tele-educa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ee1a8048f91ccbf3eaa6494ce9fccd9
https://doi.org/10.1007/978-94-007-7618-0_420
https://doi.org/10.1007/978-94-007-7618-0_420
Publikováno v:
Frontier & Future Development of Information Technology in Medicine & Education; 2014, p3261-3268, 8p
Publikováno v:
2015 IEEE 17th Electronics Packaging & Technology Conference (EPTC); 1/1/2015, p1-4, 4p
IT changes everyday's life, especially in education and medicine. The goal of ITME 2013 is to further explore the theoretical and practical issues of IT in education and medicine. It also aims to foster new ideas and collaboration between researchers