Zobrazeno 1 - 10
of 68
pro vyhledávání: '"Yinbo Chen"'
Autor:
Haiying Ding, Jiao Sun, Yu Song, Wenxiu Xin, Junfeng Zhu, Like Zhong, Yinbo Chen, Yiwen Zhang, Yinghui Tong, Luo Fang
Publikováno v:
Frontiers in Oncology, Vol 11 (2021)
BackgroundBlood supply, which is crucial for nutrition and drug delivery, was determined by microvessel density as well as the diffusion distance between vessels and cancer cells. Therefore, we evaluated the distance from microvessels to cancer cells
Externí odkaz:
https://doaj.org/article/24484b6d0f7542cb9c063e6e24c0f4da
Publikováno v:
Acta Metallurgica Sinica (English Letters). 35:1184-1194
Microstructural evolution and failure analysis of Sn–Bi57–Ag0.7 solder joints during thermal cycling
Publikováno v:
Journal of Materials Science: Materials in Electronics. 33:1942-1952
Although many studies have reported the behaviors of thermal cycling of Sn-based solder joints, the corresponding mechanism is difficult to describe universally due to the complexity of different cases. In the present study, microstructural evolution
Autor:
Victor Matveev, Yinbo Chen
Publikováno v:
Biophysical Journal. 120:1942-1956
We examine closed-form approximations for the equilibrium Ca2+ and buffer concentrations near a point Ca2+ source representing a Ca2+ channel, in the presence of a mobile buffer with two Ca2+ binding sites activated sequentially and possessing distin
Autor:
Zeyuan Chen, Yinbo Chen, Jingwen Liu, Xingqian Xu, Vidit Goel, Zhangyang Wang, Humphrey Shi, Xiaolong Wang
Videos typically record the streaming and continuous visual data as discrete consecutive frames. Since the storage cost is expensive for videos of high fidelity, most of them are stored in a relatively low resolution and frame rate. Recent works of S
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e4d2b98a5c977950f75ffcb4e216aa46
http://arxiv.org/abs/2206.04647
http://arxiv.org/abs/2206.04647
Publikováno v:
Journal of Materials Science: Materials in Electronics. 32:2172-2186
To optimize the mechanical properties of low-Ag lead-free solder, different amount of Bi element was added into the Sn–1.0Ag–0.5Cu (SAC105) to form SAC105-xBi (0 ≤ x ≤ 4) solder alloy. The microstructural evolution and shear fracture of SAC10
Publikováno v:
Acta Metallurgica Sinica (English Letters). 33:1388-1396
A U-shape clamp was designed to apply stress perpendicular to the interface of Cu/Sn/Cu solder joints, and its influence on the growth behavior of Cu–Sn intermetallic compound (IMC) during thermal aging at 150 °C was investigated. The results show
Publikováno v:
Lecture Notes in Computer Science ISBN: 9783031198175
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e214f2fc71706aff2b0727e455b84235
https://doi.org/10.1007/978-3-031-19818-2_28
https://doi.org/10.1007/978-3-031-19818-2_28
A prominent approach to visual Reinforcement Learning (RL) is to learn an internal state representation using self-supervised methods, which has the potential benefit of improved sample-efficiency and generalization through additional learning signal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5cc13d977326423eb6adae5fd19b3aa8