Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Yin-Fa Chen"'
Autor:
De-Fen Shih, Jyh-Liang Wang, Sou-Chih Chao, Yin-Fa Chen, Kuo-Sheng Liu, Yi-Shan Chiang, Chi Wang, Min-Yu Chang, Shu-Ling Yeh, Pao-Hsien Chu, Chao-Sung Lai, Der-Chi Shye, Lun-Hui Ho, Chia-Ming Yang
Publikováno v:
Sensors, Vol 20, Iss 16, p 4619 (2020)
Pressure injury is the most important issue facing paralysis patients and the elderly, especially in long-term care or nursing. A new interfacial pressure sensing system combined with a flexible textile-based pressure sensor array and a real-time rea
Externí odkaz:
https://doaj.org/article/e7d8a6a7902540db9c26cc9adbd7182c
Autor:
Yin-Fa Chen, 陳盈發
94
For reduce the operating cost of corporation and the heavy burden of management, many enterprise of Taiwan step into the breach as another fell to go to China on investing capital to build factory since the Government of Taiwan opened up “t
For reduce the operating cost of corporation and the heavy burden of management, many enterprise of Taiwan step into the breach as another fell to go to China on investing capital to build factory since the Government of Taiwan opened up “t
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/29841980922255066004
Autor:
Yin-Fa Chen, 陳銀發
93
The effects of adding 0~1.5wt% Cu into Sn-3Ag-2Sb lead-Free solder on the melting point and microstructure as well as the interfacial IMC（Intermetallic Compound） layer are studied in this reseach. The Single Lap specimens and high tempera
The effects of adding 0~1.5wt% Cu into Sn-3Ag-2Sb lead-Free solder on the melting point and microstructure as well as the interfacial IMC（Intermetallic Compound） layer are studied in this reseach. The Single Lap specimens and high tempera
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/64983371988402582158
Autor:
Der-Chi Shye, Chao-Sung Lai, Chia-Ming Yang, Pao-Hsien Chu, K.-L. Liu, Jyh-Liang Wang, Yi-Shan Chiang, Min-Yu Chang, Lun-Hui Ho, De-Fen Shih, Yin-Fa Chen, Chi Wang, Sou-Chih Chao, Shu-Ling Yeh
Publikováno v:
Sensors (Basel, Switzerland)
Sensors
Volume 20
Issue 16
Sensors, Vol 20, Iss 4619, p 4619 (2020)
Sensors
Volume 20
Issue 16
Sensors, Vol 20, Iss 4619, p 4619 (2020)
Pressure injury is the most important issue facing paralysis patients and the elderly, especially in long-term care or nursing. A new interfacial pressure sensing system combined with a flexible textile-based pressure sensor array and a real-time rea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::387a149b35b7e84905caa9d2707c2797
http://europepmc.org/articles/PMC7472060
http://europepmc.org/articles/PMC7472060
Publikováno v:
Materials Science and Engineering: A. 528:3630-3638
This study investigates the effects of trace amounts of La addition on the microstructure, adhesive strength and fracture behavior of Sn–3.5Ag solder joints. The electron backscatter diffraction (EBSD) results confirmed that the face-centered cubic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c67dff22c4fc774b585a8635299b0a0c
https://doi.org/10.1016/j.msea.2011.01.090
https://doi.org/10.1016/j.msea.2011.01.090
Autor:
Yin Fa Chen, Hwa-Teng Lee
Publikováno v:
Journal of Alloys and Compounds. 509:2510-2517
An experimental investigation is performed to examine the effect of the cooling rate on the morphology of the Ag 3 Sn intermetallic compounds (IMCs) formed during the solidification of bulk eutectic Sn–3.5Ag solder and Sn–3.5Ag/Cu joints. It is s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::59f923713f9dc6f3aa18d991dd70381b
https://doi.org/10.1016/j.jallcom.2010.11.068
https://doi.org/10.1016/j.jallcom.2010.11.068
Publikováno v:
Journal of Electronic Materials. 38:2112-2121
The effects of 1 wt.%, 5 wt.%, and 10 wt.% additions of indium (In) on the microstructure and compound morphology of Sn-Ag-Sb lead-free solder joints␣were examined. The results showed that In prompts the formation of Ag3(Sn,In), Ag2(In,Sn), and InS
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::95fe8eb5945c5668782d6ffc7df2df68
https://doi.org/10.1007/s11664-009-0884-2
https://doi.org/10.1007/s11664-009-0884-2
Autor:
Hwa-Teng Lee, Yin Fa Chen
Publikováno v:
Journal of Electronic Materials. 38:2148-2157
This study evaluates the effects of different amounts of lanthanum (La) additions on the microstructure and microhardness of Sn-3.5Ag solders. Sn-3.5Ag-xLa ternary solders were prepared by adding 0 wt.% to 1.0 wt.% La to Sn-3.5Ag alloy. Copper substr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2beefd4f93c048beb9003f0e855a02ac
https://doi.org/10.1007/s11664-009-0863-7
https://doi.org/10.1007/s11664-009-0863-7
Publikováno v:
Journal of Electronic Materials. 37:867-873
This study investigates the effects of Sb addition on the shear strength and fracture behavior of Sn-Ag-based solders with Au/Ni-P/Cu underbump metallization (UBM) substrates. Sn-3Ag-xSb ternary alloy solder joints were prepared by adding 0 wt.% to 1
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::527a7e68c1e67f7c5bf8a90300dc5e3f
https://doi.org/10.1007/s11664-008-0396-5
https://doi.org/10.1007/s11664-008-0396-5
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
The present article investigated the performance and interfacial behavior between Cu wire bond and Al pad under molding compounds of different chlorine contents. The epoxy molding compounds (EMCs) were categorized as ultra-high chlorine, high chlorin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e5829ce7da568bcff77ac84b4acf9eda
https://doi.org/10.1109/ectc.2014.6897319
https://doi.org/10.1109/ectc.2014.6897319