Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Yih-Pin Liew"'
Publikováno v:
Soldering & Surface Mount Technology. 12:37-41
The impact of underfill properties on the thermomechanical reliability of flip chip on board (FCOB) assembly is addressed in this paper. FCOB assemblies using three underfill encapsulants were subjected to a thermal cycling test. The performance of t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dac500e2d4514512d457ded8f80d5fb3
https://doi.org/10.1108/09540910010331455
https://doi.org/10.1108/09540910010331455
In order to resolve atmospheric features, such as gravity waves to the degree necessary for accurate optical turbulence prediction, we developed an adaptive version of MM5 that incorporates the NCSU Dynamic Solution Adaptive Grid Algorithm (DSAGA) an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e08cef2b61d5041edea7ad84b8789fa
https://doi.org/10.21236/ada440414
https://doi.org/10.21236/ada440414
Publikováno v:
42nd AIAA Aerospace Sciences Meeting and Exhibit.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c6e0b63a8f91953b4a490ab14e6adca
https://doi.org/10.2514/6.2004-1126
https://doi.org/10.2514/6.2004-1126