Zobrazeno 1 - 10
of 28
pro vyhledávání: '"Yidian Shi"'
Publikováno v:
Journal of Materials Research and Technology, Vol 22, Iss , Pp 1449-1461 (2023)
Experimental fracture mechanics at the microscale became an indispensable tool for understanding and analyzing the solder joint degradation in microelectronics packaging, which is facing severe temperature swings and is prone to failure due to the de
Externí odkaz:
https://doaj.org/article/8ccb0184509644b3adf537acbb7505d9
Publikováno v:
Micromachines, Vol 14, Iss 10, p 1953 (2023)
The era of 20 nm integrated circuits has arrived. There exist abundant heterogeneous micro/nano structures, with thicknesses ranging from hundreds of nanometers to sub-microns in the IC back end of the line stack, which put stringent demands on the r
Externí odkaz:
https://doaj.org/article/aec6f7295ed64fff9d58814899309278
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8bd38ff1474df2f867a6380c7da5d916
https://doi.org/10.1109/icept56209.2022.9873323
https://doi.org/10.1109/icept56209.2022.9873323
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:1266-1275
Solid diffusion bonding of the copper–zinc system is preliminarily investigated as a possible bonding solution for power modules. This article proposed a method of bonding Zn foil on substrate-plated Ag to obtain the solder joints. The formation an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0a0a31c42feb080a69ed8aceb011ebf5
https://doi.org/10.1109/tcpmt.2020.3007170
https://doi.org/10.1109/tcpmt.2020.3007170
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
Die-attach solder layer plays key effects in realizing the functions of power devices. The defects induced in soldering process and accumulated damage during service are the main challenges to the lifetime of power modules. Regarding the service cond
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0c3ddc47e3ddf1886c03d8055e0fa3d7
https://doi.org/10.1109/icept52650.2021.9568219
https://doi.org/10.1109/icept52650.2021.9568219
Publikováno v:
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
The CTE mismatch of copper metallization and Al 2 O 3 ceramics deteriorated package reliability of power electronics. Stresses in metal-ceramics interface initiate cracks and delamination when facing with thermal shock condition. Consequently, resear
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c5d0dafbc24eae8ad6839b64a6a93285
https://doi.org/10.1109/icept50128.2020.9202544
https://doi.org/10.1109/icept50128.2020.9202544
Autor:
Zhanhong Yang, Jinlei Meng, Hongzhe Chen, Yao Rong, Linlin Chen, Yidian Shi, Lie Deng, Jian Wu
Publikováno v:
Journal of Power Sources. 474:228569
Zinc ion batteries (ZIBs) have great competitiveness in large-scale energy storage because of their low price, environmental friendliness, safety and efficiency. In this work, we study a composite material of V3O7/V2O5 as the cathode in ZIBs. Owing t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3aa11425bd1bfa83d1efe26d5b9f11c4
https://doi.org/10.1016/j.jpowsour.2020.228569
https://doi.org/10.1016/j.jpowsour.2020.228569
Publikováno v:
Micromachines; Oct2023, Vol. 14 Issue 10, p1953, 14p
Publikováno v:
IEEE Transactions on Components, Packaging & Manufacturing Technology; Jan2022, Vol. 12 Issue 1, p42-50, 9p
Publikováno v:
IEEE Transactions on Components, Packaging & Manufacturing Technology; Aug2020, Vol. 10 Issue 8, p1266-1275, 10p