Zobrazeno 1 - 10
of 26
pro vyhledávání: '"Yida Zou"'
Publikováno v:
The International Journal of Advanced Manufacturing Technology. 125:47-71
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::582bad960c57d04e59660e543edf7459
https://doi.org/10.1007/s00170-022-10775-2
https://doi.org/10.1007/s00170-022-10775-2
With integrated circuit (IC) technology nodes below 20 nm, the chemical mechanical polishing (CMP) of cobalt (Co)-based copper (Cu) interconnection has been gradually changed to one-step polishing, which requires rapid removal rate (RR) of Cu while c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eaa472b45f2e69e30d3dae4dacbcdf0d
https://doi.org/10.21203/rs.3.rs-1909550/v1
https://doi.org/10.21203/rs.3.rs-1909550/v1
Publikováno v:
ECS Journal of Solid State Science and Technology. 12:044007
With integrated circuit (IC) technology nodes below 20 nm, the chemical mechanical polishing (CMP) of cobalt (Co)-based copper (Cu) interconnection has been gradually changed to one-step polishing, which requires rapid removal rate (RR) of Cu while c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::77e11e011897b16b3a5a844deaad1e1f
https://doi.org/10.1149/2162-8777/accd99
https://doi.org/10.1149/2162-8777/accd99
Publikováno v:
Journal of Electronic Packaging. 125:602-608
An exact analysis is presented for the stresses and deflections of circular plates (glass windows) elastically restrained along its edge in a photonic device’s housing subjected to the pressure and temperature loadings. Dimensionless curves and cha
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bd24df676352fd8ba920fea5a5d6ff8a
https://doi.org/10.1115/1.1604807
https://doi.org/10.1115/1.1604807
Publikováno v:
JSME International Journal Series C. 40:346-352
In this paper, the dynamic response of a rectangular elastic plate supported by a fluid on one side and impacted by a low velocity projectile on the other side is analyzed for the first time. A nonlinear Volterra integral equation for impact force F(
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::634176fb27354f6062d8b46c00aa1a6e
https://doi.org/10.1299/jsmec.40.346
https://doi.org/10.1299/jsmec.40.346
Publikováno v:
Review of Scientific Instruments. 66:3676-3679
In this paper, the dynamic behavior of a strain gauge pressure transducer is analyzed with the one‐dimensional elastic wave theory. An infinite series type formulation for the output strain of the transducer is put forward and proved to be correct
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::921f858b14001e6573d0b022d1913c74
https://doi.org/10.1063/1.1145487
https://doi.org/10.1063/1.1145487
Publikováno v:
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging.
Printed circuit boards (PCBs) are the essential parts to assemble modern electronic circuits. The PCB design and development process has a direct impact on the system cost and time to market. On average, companies report that PCB represents 31% of th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::91779497173c3b81670b86cdab548395
https://doi.org/10.1109/icept-hdp.2012.6474559
https://doi.org/10.1109/icept-hdp.2012.6474559
Publikováno v:
Journal of Vibration and Acoustics. 116:67-70
This work considers the dynamic response of an elastic plate with arbitrary boundary shape supported by a linear viscoelastic Winkler foundation, and impacted by a low velocity projectile. A nonlinear Volterra integral equation on impact force F (t)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::85936ec13d12a33e7b497b7bb6e3fb7d
https://doi.org/10.1115/1.2930398
https://doi.org/10.1115/1.2930398
Autor:
Bangalore J. Shanker, Yida Zou, R. Duong, Jie Xue, Wheling Cheng, Ken Hubbard, M. Brillhart, Mudasir Ahmad, S. Priore, Sergio Camerlo
Publikováno v:
Proceedings Electronic Components and Technology, 2005. ECTC '05..
This paper briefly presents how silicon integration and advances in packaging technology have enabled higher performance networking products, and is followed by discussions of how a system-level integrated approach is needed to address the challenges
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a3da3b517eb0945ca61cfe96a4b614db
https://doi.org/10.1109/ectc.2005.1441383
https://doi.org/10.1109/ectc.2005.1441383
Publikováno v:
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
The development and deployment of very fast signaling technologies for communication across the backplane has introduced the need for a multidisciplinary design approach where the performance of the silicon to silicon communication channel is address
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b383a40dd756f71a945eb74e2da1ae24
https://doi.org/10.1109/ectc.2004.1319067
https://doi.org/10.1109/ectc.2004.1319067