Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Yi-Shu Hsieh"'
Publikováno v:
Thin Solid Films. 685:414-419
We report a metal-insulator-semiconductor (MIS) diode with an α-Ga 2 O 3 thin-film insulator layer grown by liquid-phase deposition (LPD). α-Ga 2 O 3 exhibits a high energy bandgap of 4.9–5.3 eV, which can effectively reduce the leakage current d
Publikováno v:
2017 International Conference on Electronics Packaging (ICEP).
Nowadays, copper bump is often used in driver IC which usually used in high current density environment. High current density leads to electromigration. Therefore, the main objective of this paper is reliability analysis, including observing the chan
Autor:
Yi-Shu Hsieh, Po-Wen Wang, Chien-Yu Li, Shang-Ju Hsieh, Ching-Yu Wang, Dei-Wei Chou, Na-Fu Wang, Mau-Phon Houng
Publikováno v:
Sensors & Materials; 2020, Vol. 32 Issue 5, part 3, p1843-1850, 8p
Autor:
Yi-Shu, Hsieh
Thesis (M.A.)--National Tsing Hua University Engineering and System Science
Non-Latin script record. Includes bibliographical references
Non-Latin script record. Includes bibliographical references