Zobrazeno 1 - 10
of 30
pro vyhledávání: '"Yi-Hsin Pao"'
Autor:
D. R. Liu, Yi-Hsin Pao
Publikováno v:
Journal of Electronic Materials. 26:1058-1064
The present study investigates the thermal fatigue crack propagation path in a eutectic solder joint between a 2512 leadless chip resistor and a printed wiring board which had experienced thermal cycling between -55 and 125°C. This was achieved thro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a435f298e14aa9e25ffc55f15e49d93e
https://doi.org/10.1007/s11664-997-0244-z
https://doi.org/10.1007/s11664-997-0244-z
Publikováno v:
Journal of Electronic Packaging. 119:163-170
The application of Ball Grid Array (BGA) technology in electronic packaging on high I/O plastic and ceramic packages has grown significantly during the past few years. Although PBGA (plastic BGA) has several advantages over fine-pitch Quad Flat Pack
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c19b75e2e333462bf39e854eaaa7076c
https://doi.org/10.1115/1.2792229
https://doi.org/10.1115/1.2792229
Publikováno v:
Journal of Electronic Packaging. 117:100-104
The plastic deformation kinetics of 95.5Sn4Cu0.5Ag solder joints were determined in monotonic loading shear over the temperature range of 25°–150°C using three types of tests: (a) constant shear rate, (b) constant shear stress (creep), and (c) di
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f434d127f065420a160400698274b117
https://doi.org/10.1115/1.2792074
https://doi.org/10.1115/1.2792074
Autor:
Edward Chan-Jiun Jih, Yi-Hsin Pao
Publikováno v:
Journal of Electronic Packaging. 117:94-99
Failures in electronic packaging under thermal fatigue often result from cracking in solder joints due to creep/fatigue crack growth. A nonlinear, time-dependent finite element analysis was performed to study the effect of critical design parameters
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::746279b202d2727d5b0f22854257401e
https://doi.org/10.1115/1.2792087
https://doi.org/10.1115/1.2792087
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A. 18:627-633
The primary objective of this combined experimental and analytical study was to investigate the mechanical behavior of glass/conductive adhesive/Al/sub 2/O/sub 3/ systems with a surface notch, measure the properties of the system at various temperatu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3612aa9d031b191a2b74316d7c27ff1f
https://doi.org/10.1109/95.465162
https://doi.org/10.1109/95.465162
Publikováno v:
Journal of Electronic Packaging. 115:147-152
The thermal cyclic shear stress/strain hysteresis response and associated steady-state creep parameters of 97Sn-3Cu solder joints have been determined using a beam specimen previously developed by Pao et al. (1992a). The solder joint was subjected to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::76a2d5762256071c21f29585fa7656bb
https://doi.org/10.1115/1.2909310
https://doi.org/10.1115/1.2909310
Publikováno v:
Journal of Electronic Packaging. 115:1-8
A solder joint specimen has been designed to determine the stress/strain hysteresis response and fracture behavior of 90 percent wtPb/10 percent wtSn solder alloy. The specimen consists of an Al2O3 beam and an Al 2024-T4 beam bonded together at the e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::abbf6b6fc2fc318674eb5318e6655aa2
https://doi.org/10.1115/1.2909296
https://doi.org/10.1115/1.2909296
Autor:
Ron Cooper, Linda J. Baumgartner, Richard L. Allor, R. K. Govila, Yi-Hsin Pao, Scott J. Badgley
Publikováno v:
Journal of Electronic Packaging. 114:135-144
Failures in electronic packages under thermal fatigue usually result from cracking in solder joints due to creep/fatigue crack growth. Understanding the stress/strain behavior of such solder joints is the first step in characterizing their fracture b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e9e9f1ad8e0d48210dcbac9d913111fa
https://doi.org/10.1115/1.2906410
https://doi.org/10.1115/1.2906410
Autor:
Yi-Hsin Pao
Publikováno v:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 15:559-570
The approach developed is based on the assumption that thermal fatigue crack propagation in solder joints is primarily controlled by C* and J integrals. The effect of microstructural coarsening on crack propagation is discussed. A fracture criterion,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3c828e8ff0768eb502aab300aefafab9
https://doi.org/10.1109/33.159886
https://doi.org/10.1109/33.159886
Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading
Autor:
Ellen Eisele, Yi-Hsin Pao
Publikováno v:
Journal of Electronic Packaging. 113:164-172
An analytical approach has been developed to evaluate the interfacial shear and peel stresses in multilayered thin stacks subjected to uniform temperature variation. The approach, which is based on an extension of Suhir’s bimetal thermostat model,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d574725b1ce97383634229e61cafc249
https://doi.org/10.1115/1.2905382
https://doi.org/10.1115/1.2905382