Výsledky vyhledávání

Effects of Concentration of Adipic Acid on the Electrochemical Migration of Tin for Printed Circuit Board Assembly

Autor: Yi Sing Goh, A. S. M. A. Haseeb, Wan Jeffrey Basirun, Yew Hoong Wong, Mohd Faizul Mohd Sabri, Boon Yew Low

Publikováno v: Journal of Electronic Materials. 52:2236-2249

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::f594745d52acb8678edbe685b9c37b21
https://doi.org/10.1007/s11664-022-10155-2

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Formation and nanomechanical properties of intermetallic compounds in electrodeposited Cu–Sn–Co multilayers

Autor: Yi Sing Goh, Pay Ying Chia, A.S.M.A. Haseeb, Yingxin Goh

Publikováno v: Journal of Materials Science: Materials in Electronics. 32:9490-9499

The properties of the intermetallic compounds (IMCs) formed at the interface between the solder and the Under Bump Metallization (UBM) are crucial for the reliability of solder joints. Cobalt (Co) is a potential candidate for UBM since it can act as

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::f9ad74cc8a01580a3a4db7d03217370f
https://doi.org/10.1007/s10854-021-05612-3

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Review—Electrochemical Migration in Electronic Materials: Factors Affecting the Mechanism and Recent Strategies for Inhibition

Autor: Ee Lynn Lee, Yi Sing Goh, A. S. M. A. Haseeb, Yew Hoong Wong, Mohd Faizul Mohd Sabri, Boon Yew Low

Publikováno v: Journal of The Electrochemical Society. 170:021505

Electrochemical migration (ECM) is one of the serious failure modes encountered in electronic devices due to the electrochemical reactions triggered by the presence of moisture and bias voltage, leading to the growth of dendrites and short circuits.

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::295c8d490e414287c92ae9bce9dea55b
https://doi.org/10.1149/1945-7111/acb61a

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Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers

Autor: A.S.M.A. Haseeb, Ee Lynn Lee, Meng Teck Ong, Yi Sing Goh, Yingxin Goh

Publikováno v: Journal of Materials Science: Materials in Electronics. 29:5791-5798

Intermetallic compounds (IMC) form during the metallurgical bonding processes when the interfaces involve solid metal and molten solder. Cobalt (Co) is a promising candidate to be used as under bump metallization (UBM) material, tin (Sn)-based solder

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::db533f82447735a1f2d056f352d65479
https://doi.org/10.1007/s10854-018-8550-1

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