Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Yi Fu Shen"'
Publikováno v:
Journal of Thermal Spray Technology. 31:1232-1243
Publikováno v:
Advanced Materials Research. 1142:260-264
The investigation on friction stir lap welding (FSLW) of dissimilar Cu and Ti is reported in this research, aiming to achieve a reliable solid-state joining and effectively control the intermetellic (IMC) formation at the lapping Cu/Ti dissimilar wel
Publikováno v:
Materials Science Forum. 877:380-386
The deformation behaviours and microstructure transformations during the cold rolling process of Al-1.4Fe-0.2Mn alloy sheets prepared from 99.7% pure aluminium were investigated by means of hardness-testing, transmission electron microscopy (TEM) and
Publikováno v:
DEStech Transactions on Engineering and Technology Research.
The technological innovation of joint method for dissimilar metals of titanium (Ti) and copper (Cu) still stays in demand. The promising joining method of friction stir lap welding was successfully introduced to produce the defect-free and high-perfo
Publikováno v:
Journal of Electronic Materials. 43:3404-3410
The mechanism of reaction between Nd and Ga in Sn-Zn-0.5Ga-xNd solder was investigated in order to enhance the reliability of soldered joints. It was found that, after aging treatment at ambient temperature and 125°C for over 3000 h, no Sn whisker g
Publikováno v:
Journal of Materials Science: Materials in Electronics. 25:3520-3525
The wettability and interfacial whiskers of Sn–9Zn–0.5Ga–0.08Nd solder were investigated. The results indicated that Sn–9Zn–0.5Nd–0.08Nd solder has shown good wettability using water soluble flux and self made flux based on wetting balanc
Publikováno v:
Soldering & Surface Mount Technology. 24:280-286
PurposeThe purpose of this paper is to improve the properties of Sn−9Zn solder, so as to meet the requirements of industrial applications.Design/methodology/approachThe effects of Praseodymium on property and Sn whisker growth under aging treatment
Publikováno v:
Journal of Materials Science: Materials in Electronics. 23:1272-1278
The effects of Nd on wettability, microstructure and mechanical properties of Sn–9Zn–Ga–xNd lead-free solder were investigated. The results indicate that adding moderate amount of rare earth Nd, the wettability as well as mechanical properties
Publikováno v:
Advanced Materials Research. 326:151-156
Pulse current (PC) electro-deposition combined with the ultrasonic (U) field has been used to fabricate pure nickel and nickel-ceria composite coatings. Morphology, ceria (RE) composite, and crystal-texture were observed and analyzed by using environ
Autor:
Yi-fu Shen, Zongjie Han, Sheng-lin Yu, Hong Zhu, Liang Zhang, Xue Peng, Songbai Xue, Lili Gao, Yan Chen
Publikováno v:
Soldering & Surface Mount Technology. 23:177-183
PurposeThe purpose of this paper is to investigate the laser soldering of fine pitch quad flat package (QFP) devices using lead‐free solders and solder joint reliability during thermal cycling.Design/methodology/approachQFP devices were selected as