Zobrazeno 1 - 10
of 70
pro vyhledávání: '"Yi Chieh Tsai"'
Publikováno v:
International Journal of Food Properties, Vol 27, Iss 1, Pp 897-908 (2024)
Cordyceps militaris (CM) is a critical fungus for promoting health, while the cordycepin has been recognized as an indicator compound with bioactive functions such as induction of apoptosis, anti-inflammation, inhibition of angiogenesis, and antioxid
Externí odkaz:
https://doaj.org/article/dcd663a4df984918bd6763a7e8448413
Autor:
Pu‐Tien Chiang, Hsin‐Hsi Tsai, Ruoh‐Fang Yen, Yi‐Chieh Tsai, Chi‐Han Wu, Ching‐Hung Chiu, Li‐Kai Tsai
Publikováno v:
Annals of Clinical and Translational Neurology, Vol 11, Iss 2, Pp 497-507 (2024)
Abstract Objective F‐18‐fluorothymidine (FLT) is a positron emission tomography (PET) tracer for imaging cell proliferation in vivo. We aimed to assess FLT uptake as a marker for cerebral cell proliferation in a rat model of ischemic stroke and p
Externí odkaz:
https://doaj.org/article/5439f013b2dc4e25a55b67edce74b0e4
Autor:
Ting-Chun Lin, Yi-Chieh Tsai, Yun-An Chen, Tai-Horng Young, Chung-Che Wu, Yung-Hsiao Chiang, Chia-Hsin Kao, Abel Po-Hao Huang, Yi-Hua Hsu, Kai-Yun Chen, Li-Kai Tsai
Publikováno v:
Frontiers in Cellular Neuroscience, Vol 17 (2023)
Background and purposeIntracerebral hemorrhage (ICH) enhances neurogenesis in the subventricular zone (SVZ); however, the mechanism is not fully understood. We investigated the role of brain-derived neurotrophic factor (BDNF) in post-ICH neurogenesis
Externí odkaz:
https://doaj.org/article/6a417eb602fe4bc997d37849baa5ff77
Publikováno v:
IEEE Journal of the Electron Devices Society, Vol 10, Pp 791-796 (2022)
In this study, an advanced 2.3D solution was proposed to integrate RDL interposer and FR-4 substrate using the technique of hybrid soldering, which applies printing of epoxy solder paste to form the hybrid joint. The simulation was performed to evalu
Externí odkaz:
https://doaj.org/article/8d21684d5a534699b36a18c981a66fd4
Autor:
Hsin-Lun Lee, Yi-Chieh Tsai, Narpati Wesa Pikatan, Chi-Tai Yeh, Vijesh Kumar Yadav, Ming-Yao Chen, Jo-Ting Tsai
Publikováno v:
Biomedicines, Vol 11, Iss 7, p 2081 (2023)
Background: Hepatocellular carcinoma is the sixth most diagnosed malignancy and the fourth most common cause of cancer-related mortality globally. Despite progress in the treatment of liver cancer, nonsurgical treatments remain unsatisfactory, and on
Externí odkaz:
https://doaj.org/article/572e068342e74eaab91bc9c32b4f16b0
Autor:
Li‐Kai Tsai, I‐Hsin Chen, Chi‐Chao Chao, Hsueh‐Wen Hsueh, Hsin‐Hsiung Chen, Yun‐Hsin Huang, Rong‐Wei Weng, Tzu‐Yun Lai, Yi‐Chieh Tsai, Yeou‐Ping Tsao, Show‐Li Chen
Publikováno v:
Journal of Cachexia, Sarcopenia and Muscle, Vol 12, Iss 3, Pp 665-676 (2021)
Abstract Background Nuclear receptor interaction protein (NRIP) co‐localizes with acetylcholine receptor (AChR) at the neuromuscular junction (NMJ), and NRIP deficiency causes aberrant NMJ architecture. However, the normal physiological and pathoph
Externí odkaz:
https://doaj.org/article/f75f25155c3945599d0045d3817cf184
Autor:
Yi-Chieh Tsai, Hsin-Lun Lee, Chia-Chun Kuo, Chun-You Chen, Kevin Li-Chun Hsieh, Meng-Huang Wu, Yu-Ching Wen, Hsiao-Wei Yu, Fang-Chi Hsu, Jo-Ting Tsai, Jeng-Fong Chiou
Publikováno v:
International Journal of Hyperthermia, Vol 36, Iss 1, Pp 931-936 (2019)
Background: Magnetic resonance-guided focused ultrasound surgery (MRgFUS) is an alternative local therapy for patients with painful bone metastasis. However, little is known about the prognostic and predictive factors of MRgFUS in treating bone metas
Externí odkaz:
https://doaj.org/article/160bde610e954e758b35031e54744d1c
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13:120-126
Publikováno v:
IEEE Transactions on Electron Devices. 68:5779-5783
Different combinations of metal thin films were investigated as metal interconnect for miniaturized microelectromechanical system (MEMS) encapsulation with stable electrical properties and sealing capability. The candidates of metal as the adhesion l
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).