Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Yew Cheong Mui"'
Publikováno v:
2008 10th Electronics Packaging Technology Conference.
Solid thermal interface materials are often used in thermal reliability tests of IC packages to minimize contact thermal resistance without contaminating the test environment. In this paper, thermal characterizations of solid thermal interface materi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::92cba7e8133e08f32ec5992f674cc727
https://doi.org/10.1109/eptc.2008.4763638
https://doi.org/10.1109/eptc.2008.4763638
Publikováno v:
2007 9th Electronics Packaging Technology Conference.
With the increasing connection density of ICs, the bump pitch is growing smaller and smaller. The limitations of the conventional solder bumps are becoming more and more obvious due to the spherical geometry of the solder bumps. A novel interconnect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::27f40d15e7acaa8909259ca94fe524ba
https://doi.org/10.1109/eptc.2007.4469726
https://doi.org/10.1109/eptc.2007.4469726
Publikováno v:
2005 7th Electronic Packaging Technology Conference.
Voids in flip chip packaging of organic land grid array (OLGA) caused by the inclusion of air, other gases and moisture were studied and experiments were designed to understand the cause of void formation. Reactions among the solder mask, flux residu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cd962b3b5c6083e437d088a077cf66ee
https://doi.org/10.1109/eptc.2005.1614495
https://doi.org/10.1109/eptc.2005.1614495
Autor:
Liu Bao Min, Yew Cheong Mui
Publikováno v:
2005 7th Electronic Packaging Technology Conference.
TIM characterization is critical for the thermal solutions of higher power IC chips, like microprocessors. This paper firstly reviews the interface resistance between two contacting solids, thermal interface materials and standard test methodology ba
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4803a5ef1af3b8e0dabe0d7255cf05f5
https://doi.org/10.1109/eptc.2005.1614461
https://doi.org/10.1109/eptc.2005.1614461
Publikováno v:
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
Chip scale packages have seen a growth of over two times in the last two years and are expected to have more demands in the booming telecommunications market. This rapid growth of chip scale packages combined with green packaging solutions has made t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1d9204c8d33e0c67b6fe84ddeb0aa8e1
https://doi.org/10.1109/ectc.2001.927802
https://doi.org/10.1109/ectc.2001.927802
Publikováno v:
2001 Proceedings 51st Electronic Components & Technology Conference (Cat. No.01CH37220); 2001, p665-670, 6p