Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Yesul Ahn"'
Autor:
Dongjoo Park, Shengmin Wen, Choonheung Lee, Jinseong Kim, Juhoon Yoon, Byoungwoo Cho, Yesul Ahn, Gyuwan Han, Lou Nicholls
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Due to rapid growth in the mobile industry, Package-on-Package (PoP) has been widely adopted for 3D integration of logic and memory devices within mobile handsets, and other portable multimedia products, etc. Typical PoP configuration includes a logi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4fa3a8ba436ad58a168cc8d8417c19b8
https://doi.org/10.1109/ectc.2014.6897469
https://doi.org/10.1109/ectc.2014.6897469
Autor:
Akito Yoshida, Byoungwoo Cho, Jinseong Kim, Yesul Ahn, Dongjoo Park, Juhoon Yoon, Gyuwan Han, Choon Heung
Publikováno v:
2013 3rd IEEE CPMT Symposium Japan.
Package-on-package (PoP) has been widely adopted for 3D integration of logic and memory within mobile handsets and other portable multimedia devices. Typical PoP solution is applied to logic processor as bottom package and memory device as top packag
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::976ade6b0c513699ac1a9445aee25d90
https://doi.org/10.1109/icsj.2013.6756077
https://doi.org/10.1109/icsj.2013.6756077