Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Yeow Meng Tan"'
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b697b00c06aa3ec105b33c3925624938
https://doi.org/10.1109/eptc56328.2022.10013114
https://doi.org/10.1109/eptc56328.2022.10013114
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5dcaadd298830b07dbc36096eaed3476
https://doi.org/10.1109/eptc56328.2022.10013183
https://doi.org/10.1109/eptc56328.2022.10013183
Autor:
Ramana Murthy, O. K. N. Khan, Siao Li Liew, Dongzhi Chi, V. N. Sekhar, T. C. Chai, Hongyu Li, John H. Lau, Yeow Meng Tan, C. K. Cheng, Xiaowu Zhang
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 2:807-816
This paper presents the study on the effect of low-κ stacked layer, chip pad design structures, and shift pad design of a large die size Cu/low-κ chip for improving assembly and reliability performance on organic buildup substrate flip chip ball gr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1f494b2d255b3ed052b7af6fd9be9c93
https://doi.org/10.1109/tcpmt.2011.2182351
https://doi.org/10.1109/tcpmt.2011.2182351
Autor:
Yeow Meng Tan
The most promising method to realise the necessary embedded structure in Low Temperature Co-fired Ceramics (LTCC) is by employing carbon sacrificial material. Process characterisation with respect to carbon burn-off, particularly under embedded condi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1d3ca90a706b48ec4615b865fcf67c9a
https://hdl.handle.net/10356/55057
https://hdl.handle.net/10356/55057
Publikováno v:
56th Electronic Components & Technology Conference 2006; 2006, p6-6, 1p