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pro vyhledávání: '"Yeo Chan Ko"'
Autor:
Hyoung Dong Kim, Jae Hak Yee, Nam Kwon Cho, Yeo Chan Ko, Mi Ri Choi, Hyung Giun Kim, You Cheol Jang, Il Tae Kang, So Yeon Park, Sung Hwan Lim, Kyo Wang Koo
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
Silver wires have become a novel bonding material in recent years. But users & field engineers are still divided over the issue of reliability performance including failure mechanism and intermetallic compounds (IMCs) formation. In this study, new ty
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a30560c7ed7f579ca6fa7fa813d53796
https://doi.org/10.1109/eptc.2014.7028359
https://doi.org/10.1109/eptc.2014.7028359
