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pro vyhledávání: '"Yeo, Chee Keng"'
Autor:
Pan, Binghua, Yeo, Chee Keng
Publikováno v:
SAE International Journal of Materials and Manufacturing, 2014 Apr 01. 7(2), 320-327.
Externí odkaz:
https://www.jstor.org/stable/26268611
Autor:
Yeo, Chee Keng.
The reliability of solder joints was studied through experimental and finite element analysis (FEA) approaches. A no clean surface mount process for the assembly of Plastic Quad Flat Packs (PQFPs) with 15.7 mil (0.4 mm) pitch and 256 leads was establ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______1392::0fcb0660361aa43ed892a8b8e020f3ea
http://hdl.handle.net/10356/20550
http://hdl.handle.net/10356/20550
