Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Yen Yi Germaine Hoe"'
Autor:
Minkyu Je, Jinglin Shi, Yong Han, Mohammad Madihian, Xiaowu Zhang, Yong Zhong Xiong, Hongyu Li, Yen Yi Germaine Hoe, Dan Zhao, Keng Hwa Teo, Jin He, Sanming Hu
Publikováno v:
IEEE Transactions on Electron Devices. 60:1282-1287
This brief proposes a guard ring using through-silicon vias (TSVs) to isolate thermal coupling in a 3-D integrated circuit (3-D IC). To verify this idea, simulation and measurement are carried out. A ring oscillator (RO) is implemented in a 65-nm CMO
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e3677bd613cc08f4eee33127272aa966
https://doi.org/10.1109/ted.2013.2243452
https://doi.org/10.1109/ted.2013.2243452
Autor:
Pinjala Damaruganath, M Ravi, John H. Lau, Ebin Liao, Vempati Srinivasa Rao, Nagarajan Ranganathan, Hong Yu Li, Yen Yi Germaine Hoe, Jiangyan Sun, Xiaowu Zhang, Eva Wai, Tai Chong Chai, C. J. Vath, C. S. Selvanayagam, Y Tsutsumi, Yue Ying Ong, Shiguo Liu, Kripesh Vaidyanathan
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 1:660-672
The continuous push for smaller bump pitch interconnection in line with smaller Cu/low-k technology nodes demands the substrate technology to support finer interconnection. However, the conventional organic buildup substrate is facing a bottleneck in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::19099bdcb6f56725b6fe9bc40b06a81b
https://doi.org/10.1109/tcpmt.2010.2101911
https://doi.org/10.1109/tcpmt.2010.2101911
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
This work describes an investigation into the performance of packaging materials, developed with a specific aim in improving thermal performance, such as silver-sintered materials that perform both die-attach and thermal-interface-material (TIM) duti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f456051c5e06bc5cb6f903fb86fa2b8d
https://doi.org/10.1109/eptc.2012.6507138
https://doi.org/10.1109/eptc.2012.6507138
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference.
A simplified numerical methodology is proposed to simulate bubble nucleation for flow boiling heat transfer in the microchannels heat sink. Flow boiling characteristics such as bubble departure frequency, bubble grow time, waiting time, and nucleatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1a14f3d94ae07a134c9d6195d073dac1
https://doi.org/10.1109/eptc.2011.6184477
https://doi.org/10.1109/eptc.2011.6184477
Autor:
Tae Goo Kang, Kripesh Vaidyanathan, Badrul Hisam Bin Johari, Sangho Kim, Meongkeun Ju, Yen Yi Germaine Hoe
Publikováno v:
2011 Defense Science Research Conference and Expo (DSR).
The importance of monitoring human hydration level is nowhere more critical than for soldiers operating in extreme outdoors conditions. A wearable non-invasive hydration level monitoring system can benefit its wearer by preventing prolonged dehydrati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a401bc65d09d6ccd9b5ff30149cd70db
https://doi.org/10.1109/dsr.2011.6026879
https://doi.org/10.1109/dsr.2011.6026879
Autor:
Siow Pin Melvin Tan, Keng Hwa Teo, Xiaowu Zhang, Fa Xing Che, Damaruganath Pinjala, Yen Yi Germaine Hoe, S. Gao
Publikováno v:
2010 12th Electronics Packaging Technology Conference.
Three dimensional integrated circuits offer significant advantages over single chip packages in terms of functionalities and footprint needed. A key technology to enable the adoption of these advanced packages in electronic systems is Through-Silicon
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::83ef3f4b1b9c351a64f47eefadb6e523
https://doi.org/10.1109/eptc.2010.5702608
https://doi.org/10.1109/eptc.2010.5702608
Autor:
Vempati Srinivasa Rao, Chong Ser Choong, Zhang Xiaowu, Gaurav Sharma, Yen Yi Germaine Hoe, Damaruganath Pinjala
Publikováno v:
2010 12th Electronics Packaging Technology Conference.
In the embedded wafer-level packaging field, the embedded micro wafer level package (EMWLP) technology leverages on fan-out redistribution connections, keeping the reliance on wire-bonding and flip-chip bump connections to a minimum, thus streamlinin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c93f22ed1311ae6a8f760ff8be7f0bda
https://doi.org/10.1109/eptc.2010.5702649
https://doi.org/10.1109/eptc.2010.5702649
Autor:
Sharon Lim Pei Siang, Zhang Xiaowu, Jong Ming Chinq, Vempati Srinivasa Rao, Aditya Kumar, Ho Soon Wee, Tang Gongyue, V. Kripesh, Damaragunath Pinjala, Gaurav Sharma, Yen Yi Germaine Hoe
Publikováno v:
2009 11th Electronics Packaging Technology Conference.
In this paper, package-level thermal modeling of the embedded micro-wafer-level-packaging (EMWLP) package has been performed to extract the parametric trends for thermal design guidelines of an eccentric single active die embedded alongside an integr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2b36ecddf0d388430af4670478d4e41c
https://doi.org/10.1109/eptc.2009.5416560
https://doi.org/10.1109/eptc.2009.5416560
Autor:
Yen Yi Germaine Hoe, Zhang Xiaowu, Chai Tai Chong, John H. Lau, Tang Gong Yue, Pinjala Damaruganath, Kripesh Vaidyanathan
Publikováno v:
2009 11th Electronics Packaging Technology Conference.
In this paper, the effect of TSV (Through Silicon Via) parameters on the equivalent thermal conductivity of TSV interposer and the effect of the TSV interposer on the thermal performance of the package have been elaborated. The modeling approach usin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d00bb974fb870c8d95338a1e0357a3fc
https://doi.org/10.1109/eptc.2009.5416445
https://doi.org/10.1109/eptc.2009.5416445
Autor:
Chen, Tai-Yu, Lee, Chung-Fa
Publikováno v:
2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p2069-2074, 6p