Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Yek Ban Liew"'
Autor:
Yek Ban Liew, Mohd Nasir Tamin
Publikováno v:
Jurnal Kejuruteraan. 20:95-106
This study examines the cyclic stress-strain response of solder joints in a surface mounted electronic assembly due to temperature cycles. For this purpose, a threedimensional model of an electronic test package is analyzed using finite element metho
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d8e129e4bff194bb18983633695d94a4
https://doi.org/10.17576/jkukm-2008-20-09
https://doi.org/10.17576/jkukm-2008-20-09
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 30:824-829
A mechanical approach employing cyclic twisting deformation to a surface mount assembly is examined as an alternative to temperature cycling for evaluating solder joints fatigue performance. This highly accelerated test is aimed at reducing solder jo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c839d611177b660be3927f6f8a43daf7
https://doi.org/10.1109/tcapt.2007.906297
https://doi.org/10.1109/tcapt.2007.906297
Publikováno v:
2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.
The mechanics of solder joints in a surface mount assembly subjected to cyclic flexural load is examined using finite element method. A test assembly with peripheral-array solder joints is supported by eight pins and arranged in a circle on the compo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::93af6c53d68f67630f17b67d239cf44a
https://doi.org/10.1109/iemt.2006.4456440
https://doi.org/10.1109/iemt.2006.4456440
Autor:
Tamin, Mohd N.1 taminmn@fkm.utm.my, Yek Ban Liew1 yekban@yahoo.com, Wagiman, Amir N. R.2 amir.nur.rashid.wagiman@intel.com, Loh, W. K.2 wei.keat.loh@intel.com
Publikováno v:
IEEE Transactions on Components & Packaging Technologies. Dec2007, Vol. 30 Issue 4, p824-829. 6p. 3 Diagrams, 3 Charts, 3 Graphs.