Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Yeh-Hsiu Liu"'
Autor:
Yeh-Hsiu Liu, 劉業繡
93
In high temperature applications, the conversion of the under metallurgy (UBM) into UBM-Sn intermetallics can ultimately limit the reliability of flip chip components. The flip chip structures employed are eutectic or high-lead Sn/Pb solder j
In high temperature applications, the conversion of the under metallurgy (UBM) into UBM-Sn intermetallics can ultimately limit the reliability of flip chip components. The flip chip structures employed are eutectic or high-lead Sn/Pb solder j
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/42291409423986081307
Autor:
Kwang-Lung Lin, Yeh-Hsiu Liu
Publikováno v:
Journal of Materials Research. 20:2184-2193
The electromigration behavior of the high-lead and eutectic SnPb composite solder bumps was investigated at 150 °C with 5 × 103 A/cm2 current stressing for up to 1711 h. The diameter of the bumps was about 125 μm. The underbump metallization (UBM)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::747b40e7894be4ae88da79475af5d726
https://doi.org/10.1557/jmr.2005.0271
https://doi.org/10.1557/jmr.2005.0271
Autor:
Kwang-Lung Lin, Yeh-Hsiu Liu
Publikováno v:
Journal of The Electrochemical Society. 150:C529
Flip chip solder bumps were produced on various bump pad dimensions by electroplating to investigate their current efficiency. The bump pad dimensions range from 60 X 60 μm to 250 X 250 μm. Bump heights are in the range of 80-150 μm. The bump heig
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::67316783c7a0231ae1f5beea929a1ad9
https://doi.org/10.1149/1.1589761
https://doi.org/10.1149/1.1589761
Autor:
Yeh-Hsiu Liu, Kwang-Lung Lin
Publikováno v:
Journal of Materials Research; Aug2005, Vol. 20 Issue 8, p2184-2193, 10p, 3 Diagrams
Publikováno v:
Journal of Materials Research; Aug2004, Vol. 19 Issue 8, p2471-2477, 7p, 7 Black and White Photographs, 3 Graphs