Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Yeeun Na"'
Publikováno v:
Micro and Nano Systems Letters, Vol 11, Iss 1, Pp 1-7 (2023)
Abstract The demand for advanced packaging is driven by the need for low-profile, densely-integrated, large-die Si devices in substrate-based or wafer-level packaging. Die strength is a critical parameter for ultrathin dies, making die singulation a
Externí odkaz:
https://doaj.org/article/a5479d5e550647c2a36caa0660c46cc0
Autor:
Yeeun Na, Chaehwan Kim, Keunhoi Kim, Tae Hyun Kim, Soo Hyun Kwon, Il-Suk Kang, Young Woo Jung, Tae Won Kim, Deok-Ho Cho, Jihwan An, Jong-Kwon Lee, Jongcheol Park
Publikováno v:
Biosensors, Vol 14, Iss 2, p 109 (2024)
Reflection-type photoplethysmography (PPG) pulse sensors used in wearable smart watches, true wireless stereo, etc., have been recently considered a key component for monitoring biological signals such as heart rate, SPO3, and blood pressure. Typical
Externí odkaz:
https://doaj.org/article/195254df7d0845a29fff206a22784f04
Autor:
Taehyun Kim, Sangwug Han, Jubum Lee, Yeeun Na, Joontaek Jung, Yun Chang Park, Jaesub Oh, Chungmo Yang, Hee Yeoun Kim
Publikováno v:
Micromachines, Vol 14, Iss 2, p 448 (2023)
Most microsensors are composed of devices and covers. Due to the complicated structure of the cover and various other requirements, it difficult to use wafer-level packaging with such microsensors. In particular, for monolithic microsensors combined
Externí odkaz:
https://doaj.org/article/82134773068a4ed49fda36ba5a4fb30b
Publikováno v:
JOURNAL OF SENSOR SCIENCE AND TECHNOLOGY. 31:361-365
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3dd63d7fc61e143fbf45aae4f1b0bc74
https://doi.org/10.46670/jsst.2022.31.6.361
https://doi.org/10.46670/jsst.2022.31.6.361