Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Yee Mong Khoo"'
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 2:1973-1979
A simple low-cost post-complementary metal-oxide-semiconductor-compatible process to enhance the performance of the planar spiral inductor in standard silicon (Si) substrate is demonstrated. In this process, the high loss and high permittivity of Si
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a58f820ebf74b5460b1953f80029ddd3
https://doi.org/10.1109/tcpmt.2012.2204879
https://doi.org/10.1109/tcpmt.2012.2204879
Publikováno v:
IEEE Transactions on Antennas and Propagation. 60:4582-4588
This paper presents the design, fabrication and “on-wafer” characterization of multi-membrane-supported and polymer-cavity-backed monopole antenna and 2t 1 patch antenna array operating in the 135-GHz frequency range. The designs were fabricated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5bac2ad0f4698b296a7ec010392653da
https://doi.org/10.1109/tap.2012.2209855
https://doi.org/10.1109/tap.2012.2209855
Autor:
C. S. Premachandran, Dim-Lee Kwong, Xiaowu Zhang, S. Gao, Siong Chiew Ong, Won Kyoung Choi, Yee Mong Khoo, Ranjan Rajoo, Ling Xie, Damaruganath Pinjala, Soon Wee Ho, C. S. Selvanayagam
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 1:510-518
Low-temperature bonds are thin intermetallic (IMC) bonds that are formed between devices when plated layers of different metals on each side of the component come into contact under relatively low temperature and high pressure. These joints, comprise
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dc3758a8ee9cd5673dca2480b9cf848f
https://doi.org/10.1109/tcpmt.2011.2107511
https://doi.org/10.1109/tcpmt.2011.2107511
Autor:
Ting Wang, Jayakrishnan Chandrappan, Yi Yoon Chai, Yee Mong Khoo, Philbert Oliver Gomex, Jing Zhang, Wei Liang Teo, P.V. Ramana, John Lau Hon Shing, V M Ramkumar, Chee Wei Tan
Publikováno v:
IEEE Transactions on Advanced Packaging. 33:428-432
A low-cost optical subassembly design for large core fiber transceiver is presented. The complete transceiver module is realized by assembling the low-cost optical subassembly directly on the transceiver functional printed circuit board. -7 dBm optic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cf3817c540b551aaad053d7d5203f1e7
https://doi.org/10.1109/tadvp.2009.2033810
https://doi.org/10.1109/tadvp.2009.2033810
Autor:
Xiaowu Zhang, Teck Guan Lim, David Ho, Yee Mong Khoo, Gao Shan, Xiong Yong Zhong, C. S. Selvanayagam, Rui Li
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
A novel Through Silicon Via (TSV) structure to mitigate the high electrical loss at high frequency is presented here. At low frequency, the loss for the TSV is caused mainly by the material loss of the Silicon (Si) substrate due to its low resistivit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::503b341a7fb8e0fe890a30a2a8ca259a
https://doi.org/10.1109/ectc.2011.5898570
https://doi.org/10.1109/ectc.2011.5898570
Publikováno v:
2010 IEEE Electrical Design of Advanced Package & Systems Symposium.
This paper presents the design and characterization of a wideband bandpass filter for millimetre-wave D-band application. The filter is implemented on a three-layer thin film structure using benzocyclobutene (BCB) silicon technology. Two stepped-impe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5208baa5f56e9c8881ac5d95eea05f74
https://doi.org/10.1109/edaps.2010.5683038
https://doi.org/10.1109/edaps.2010.5683038
Autor:
T.J. Tseng, John H. Lau, R. Chang, D. Cheng, Chee Wei Tan, C. Teo, Joey Chai, Teck Guan Lim, S. Chiang, P.V. Ramana, Li Shiah Lim, H. Chang, T. Tang, Guan Jie Yap, Yee Mong Khoo, H.L. Yee
Publikováno v:
2008 10th Electronics Packaging Technology Conference.
Optical interconnect on printed circuit board are promising for backplane and motherboard applications due to their low propagation loss and high data-transfer density as an alternative to electrical interconnections which fail to meet the increasing
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::84db5f5aaecdc46fafb11a7344e28597
https://doi.org/10.1109/eptc.2008.4763580
https://doi.org/10.1109/eptc.2008.4763580
Autor:
Teck Guan Lim, Seiji Maruo, Yi Yoon Chai, Yee Mong Khoo, P.V. Ramana, Jing Li, J.H. Lau, Chee Wei Tan
Publikováno v:
SPIE Proceedings.
Silicon Optical Bench (SiOB) is a popular solution for passive assembly of optical module. In order to realize an optical transmitter or receiver module, it is necessary to integrate high frequency optoelectronic components such as signal photodiodes
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::04abef0abe7cab05071fcccaae7c8fd6
https://doi.org/10.1117/12.764151
https://doi.org/10.1117/12.764151
Autor:
Teck Guan Lim, Yee Mong Khoo, Selvanayagam, C.S., Ho, D.S.W., Rui Li, Xiaowu Zhang, Gao Shan, Xiong Yong Zhong
Publikováno v:
2011 IEEE 61st Electronic Components & Technology Conference (ECTC); 2011, p577-582, 6p
Autor:
Chai, J., Guan Jie Yap, Teck Guan Lim, Chee Wei Tan, Yee Mong Khoo, Teo, C., Li Shiah Lim, Yee, H.L., Ramana, P.V., Lau, J., Chang, R., Tang, T., Chang, H., Chiang, S., Cheng, D., Tseng, T.J.
Publikováno v:
2008 10th Electronics Packaging Technology Conference; 2008, p1126-1130, 5p