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Autor:
Yasuhide Maehara, Akiyoshi Irisawa, Masaichi Hashimoto, Shigeki Nishina, Takanori Okada, Makoto Shinohara, Motoki Imamura, Tsuyoshi Ataka
Publikováno v:
2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
It is getting significant to identify the fault location in advanced IC packaging technology. However, challenges have been posed to precisely determine the fault location in the failure analysis process, which is difficult to be handled by the conve