Zobrazeno 1 - 10
of 63
pro vyhledávání: '"Yarui Peng"'
Publikováno v:
Frontiers in Public Health, Vol 10 (2022)
BackgroundThe efficient operation of county-level medical institutions is a significant guarantee in constructing Chinese rural tertiary care service networks. However, it is still unclear how to increase the efficiency of county hospitals under the
Externí odkaz:
https://doaj.org/article/49ebe291be3b48dfbe05453bfb7a45c2
Publikováno v:
BMJ Open, Vol 10, Iss 11 (2020)
Objective To examine the association between reimbursement rates and the length of stay (LOS).Design A retrospective cohort study.Setting The study was conducted in Shenzhen, China by using health administrative database from 1 January 2015 to 31 Dec
Externí odkaz:
https://doaj.org/article/a85601ef81d14f0690eb23579453828e
Publikováno v:
IEEE Transactions on Power Electronics. 38:4698-4713
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3831419d7452fe6788bb9ef18cadf249
https://doi.org/10.1109/tpel.2022.3227300
https://doi.org/10.1109/tpel.2022.3227300
Autor:
Chixiao Chen, Jieming Yin, Yarui Peng, Maurizio Palesi, Wenxu Cao, Letian Huang, Amit Kumar Singh, Haocong Zhi, Xiaohang Wang
Publikováno v:
IEEE Design & Test. 39:99-109
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1bdf3a1c364e5c2a7bd360588c600f53
https://doi.org/10.1109/mdat.2022.3203005
https://doi.org/10.1109/mdat.2022.3203005
Autor:
Huitink, David, Vinson, Whit, Ruby, Collin, Al Razi, Imam, Agogo-Mawuli, David, Mantooth, Alan, Yarui Peng
Publikováno v:
Journal of Microelectronic & Electronic Packaging; 2023 4th Quarter, Vol. 20 Issue 4, p107-111, 5p
Publikováno v:
2022 IEEE Energy Conversion Congress and Exposition (ECCE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0d3787f8a91eda2985022105b3c809db
https://doi.org/10.1109/ecce50734.2022.9947555
https://doi.org/10.1109/ecce50734.2022.9947555
Publikováno v:
2022 IEEE Design Methodologies Conference (DMC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a1d44a6b9fc6b8bb370352b66170be4c
https://doi.org/10.1109/dmc55175.2022.9906468
https://doi.org/10.1109/dmc55175.2022.9906468
Publikováno v:
IEEE Transactions on Power Electronics. 36:8919-8933
As a critical energy-conversion system component, power semiconductor modules and their layout optimization has been identified as a crucial step in achieving the maximum performance and density for wide bandgap technologies (i.e., GaN and SiC). New
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c9d32990650ab248e4963acc2ad4cc2b
https://doi.org/10.1109/tpel.2021.3049776
https://doi.org/10.1109/tpel.2021.3049776
Autor:
Arafat Kabir, Yarui Peng
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:715-726
With the increasing popularity and applications of 2.5-D integration, both chip and packaging industries are making significant progress in this direction. In advanced high-density 2.5-D packages, package redistribution layers become similar to chipl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9e97c6ab1773c532e26ff4e8d7884cad
https://doi.org/10.1109/tcpmt.2021.3069724
https://doi.org/10.1109/tcpmt.2021.3069724
Publikováno v:
IEEE Power Electronics Magazine. 7:46-50
The second Design Automation for Power Electronics (DAPE) workshop was held in the beautiful historical city of Genova, Italy, on 6 September 2019. This was one day after the successful European Conference on Power Electronics and Applications (EPE E
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::78f565ae2aa176fde9831de6f9de1f20
https://doi.org/10.1109/mpel.2019.2959706
https://doi.org/10.1109/mpel.2019.2959706