Výsledky vyhledávání - "Yao, Yan Han"

Conference

Alternative fine pitch solution of low cost and high throughput thermal compression bonding by using capillary underfill.

Autor: Tsai, Mike, Lan, Albert, Yao, Yan Han, Wu, Meng Yueh, Chang, Cheng Kai, Lo, Roger, Chen, Eason

Publikováno v: 2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p465-469, 5p

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