Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Yannick Vandelaer"'
Autor:
Jaber Derakhshandeh, G. Beyer, Silvia Armini, Yannick Vandelaer, Luca Di Piazza, George Vakanas, Inge De Preter, Eric Beyne, Dries Dictus, Myriam Van De Peer, Lin Hou, Stefano Guerrieri, Kevin Vandersmissen, John Slabbekoorn, Kenneth June Rebibis, Robert Daily, A. Lesniewska, Andy Miller
Publikováno v:
2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).
In this paper we report results and challenges of replacing Cu with Co as UBM (under bump metallization) in microbumps for 3D technology applications. Cobalt has softer and single IMC (intermetallic compounds) and according to calculations using Coba
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::21706b883c65e818bb336ecd309b5a8b
https://doi.org/10.1109/iitc-mam.2015.7325652
https://doi.org/10.1109/iitc-mam.2015.7325652
Autor:
Vladimir Cherman, A. Lesniewska, Fumihiro Inoue, Silvia Armini, Eric Beyne, Yannick Vandelaer, Jaber Derakhshandeh, Inge De Preter, George Vakanas
Publikováno v:
TMS2015 Supplemental Proceedings ISBN: 9781119093466
TMS 2015 144th Annual Meeting & Exhibition ISBN: 9783319486086
TMS2015 Supplemental Proceedings
TMS 2015 144th Annual Meeting & Exhibition ISBN: 9783319486086
TMS2015 Supplemental Proceedings
With scaling beyond 40um pitch 3D interconnects, cost, performance and reliability become ever more critical. Thiol-based self-assembled monolayers (SAM) were applied before to enable Cu-Cu connection in dual damascene vias [1]. In this study, we are
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b8e64d79b4fda717e3c107ee3baa7f0d
https://doi.org/10.1002/9781119093466.ch161
https://doi.org/10.1002/9781119093466.ch161
