Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Yann Le Guillou"'
Publikováno v:
Sensors, Vol 22, Iss 20, p 7995 (2022)
Continuous measurement of heart rate variability (HRV) in the short and ultra-short-term using wearable devices allows monitoring of physiological status and prevention of diseases. This study aims to evaluate the agreement of HRV features between a
Externí odkaz:
https://doaj.org/article/3f1429d76b884cafa6ab078ccb96db47
Autor:
Stephane Paquelet, Gael Kamdem De Teyou, Patrick Loumeau, Hussein Fakhoury, Herve Petit, Yann Le Guillou
Publikováno v:
ICECS
The estimation of mismatch-induced errors between the channels of a Time-Interleaved ADC is crucial for implementing an efficient calibration method. This step is often done with the assumption that all the noise sources have a white gaussian distrib
Publikováno v:
NEWCAS
Impairments between ADCs are known to severely limit the resolution and bandwidth of time-interleaved (TI) architecture. This paper proposes a general framework describing simultaneously the gain, time-skew, bandwidth and offset mismatches. Statistic
Publikováno v:
iCAST
Cognitive radio system (CRS) is a disruptive technology targeting very high spectral efficiency. This paper presents an overview of CRS and summarizes the related regulation and standardization status. We point out some key research challenges, espec
Autor:
Yann Le Guillou, Dominique Brunel
Publikováno v:
Analog Circuit Design ISBN: 9781402075599
High performance fractional-N synthesizers based on δσ modulation have significantly increased the level of integration in wireless handset transceivers. [1]
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cb27681915f142f18153f11c3e0157ba
https://doi.org/10.1007/0-306-48707-1_5
https://doi.org/10.1007/0-306-48707-1_5
Publikováno v:
IEEE Design & Test of Computers. 26:87-87
THE 2009 Design, Automation, and Test in Europe (DATE) conference, which took place in April in Nice, France, hosted a new workshop on 3D integration. The topic was vertical stacking of multiple silicon dies, interconnected by through-silicon vias, w