Zobrazeno 1 - 10
of 39
pro vyhledávání: '"Yanmei KONG"'
Autor:
Binbin Jiao, Jingping Qiao, Shiqi Jia, Ruiwen Liu, Xueyong Wei, Shichang Yun, Yanmei Kong, Yuxin Ye, Xiangbin Du, Lihang Yu, Bo Cong
Publikováno v:
Engineering, Vol 38, Iss , Pp 201-208 (2024)
In three-dimensional (3D) stacking, the thermal stress of through-silicon via (TSV) has a significant influence on chip performance and reliability, and this problem is exacerbated in high-density TSV arrays. In this study, a novel hollow tungsten TS
Externí odkaz:
https://doaj.org/article/207a6a51b9ad4f67a1e674105750a6ea
Publikováno v:
AIP Advances, Vol 8, Iss 5, Pp 055131-055131-7 (2018)
Ultra-low pressure application of Pirani gauge needs significant improvement of sensitivity and expansion of measureable low pressure limit. However, the performance of Pirani gauge in high vacuum regime remains critical concerns since gaseous therma
Externí odkaz:
https://doaj.org/article/15f23e976582415182a9a2adafbff39a
Autor:
Bo Cong, Ruiwen Liu, Yuxin Ye, Xiangbin Du, Lihang Yu, Nan Zhang, Shiqi Jia, Yanmei Kong, Binbin Jiao
Publikováno v:
Thermal Science. 27:869-880
With the development of integrated circuits, high power, and high integration chip array devices are facing the requirements of high heat flux and temperature uniformity. The micro-channel heat sink can meet the heat dissipation requirements of chip
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c0a76574eceaa0313ab58e7d3e6d4c09
https://doi.org/10.2298/tsci220315079c
https://doi.org/10.2298/tsci220315079c
Autor:
Yuxin Ye, Mei Wu, Yanmei Kong, Ruiwen Liu, Ling Yang, Xuefeng Zheng, Binbin Jiao, Xiaohua Ma, Weimin Bao, Yue Hao
Publikováno v:
IEEE Transactions on Electron Devices. 69:5470-5475
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8b06bed4e37eb23c1332a09994a946d3
https://doi.org/10.1109/ted.2022.3195482
https://doi.org/10.1109/ted.2022.3195482
Publikováno v:
Thermal Science; 2024, Vol. 28 Issue 2A, p889-901, 13p
Autor:
Lihang YU, Yuxin YE, Zhenyu WANG, Ruiwen LIU, Xiangbin DU, Yanmei KONG, Shichang YUN, Jie WANG, Yulin SHI, Binbin JIAO
Publikováno v:
Thermal Science; 2024, Vol. 28 Issue 2A, p877-888, 12p
Autor:
Lihang Yu, Yang Dai, Xiangbin Du, Zhiyong Duan, Wei Li, Binbin Jiao, Zhiqiang Wang, Bo Cong, Nan Zhang, Yanmei Kong, Liu Ruiwen, Ye Yuxin
Publikováno v:
Thermal Science. 26:1531-1543
Power chips with high power dissipation and high heat flux have caused serious thermal management problems. Traditional indirect cooling technologies could not satisfy the increasing heat dissipation requirements. The embedded cooling directly inside
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::70097e03e7f5be290374f16051dd9460
https://doi.org/10.2298/tsci210908328z
https://doi.org/10.2298/tsci210908328z
Autor:
Yawei Xu, Jiahao Wu, Ye Yuxin, Zhu Shengli, Jianyin Miao, Liu Ruiwen, Yun Shichang, Yanmei Kong, Binbin Jiao
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:2130-2139
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::df3332356ef5ede31841afba3e59036d
https://doi.org/10.1109/tcpmt.2021.3127954
https://doi.org/10.1109/tcpmt.2021.3127954
Autor:
Yuxin Ye, Jie Wang, Lihang Yu, Yanmei Kong, Ruiwen Liu, Xiangbin Du, Shichang Yun, Yulin Shi, Binbin Jiao
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b79f080b6601729a3ffc0b2d87fca97c
https://doi.org/10.1109/icept56209.2022.9873186
https://doi.org/10.1109/icept56209.2022.9873186
Autor:
Yuxin Ye, Shichang Yun, Ruiwen Liu, Wei Li, Zhiqiang Wang, Xiangbin Du, Yanmei Kong, Kunpeng Jia, Nan Zhang, Lihang Yu, Bo Cong, Shiqi Jia, Binbin Jiao, Dapeng Chen
Publikováno v:
2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::afae38314004d154c2662ed196a2f907
https://doi.org/10.1109/mems51670.2022.9699818
https://doi.org/10.1109/mems51670.2022.9699818