Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Yanggyoo Jung"'
Autor:
Yanggyoo Jung, Kwangmo Lim, Byoungwoo Cho, TaeHo Yoon, Yunseok Song, Min Ho Kim, DaeByoung Kang, Dongjoo Park, ChoongHoe Kim, JinYoung Khim, SeokHo Na
Publikováno v:
2017 IEEE CPMT Symposium Japan (ICSJ).
The semiconductor packaging technology trend for electronic products continues to achieve greater miniaturization and higher functionality. Thinner profile chip scale packaging (CSP), such as flip chip CSP (fcCSP), with increasing die complexities is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c152e66a7f4dfe6e9886c58c58a408c0
https://doi.org/10.1109/icsj.2017.8240085
https://doi.org/10.1109/icsj.2017.8240085
Autor:
ChoongHoe Kim, Choonheung Lee, Jin Young Kim, Yanggyoo Jung, Yunseok Song, DongSu Ryu, Minho Gim, Juhoon Yoon
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Conventional flip chip technologies such as the mass reflow (MR) process and the thermal compression bonding (TCB) process are commonly used technologies in the micro assembly field. However, there is a continuous need for next generation interconnec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::26a8b667c8bbaa76280019efe6534098
https://doi.org/10.1109/ectc.2016.76
https://doi.org/10.1109/ectc.2016.76
Autor:
MinJae Lee, Sungsoon Park, Myung-June (M J) Lee, Youshin Jung, Choonheung Lee, DongSu Ryu, Yanggyoo Jung, ChanHa Hwang, Sunwoo Park, Miguel Jimarez
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
Recently, technologies related to Fine Pitch Flip Chip or FPFC have been great achievements for various next generation devices, allowing a significant increase in the number of signal I/O and achieving low form factor packages. Consequently, fine pi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::708308f1ba5960d3ca68b7fdd6a8adbb
https://doi.org/10.1109/ectc.2012.6248868
https://doi.org/10.1109/ectc.2012.6248868
Autor:
Roa, Fernando
Publikováno v:
2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p470-474, 5p
Autor:
Tsai, Mike, Lan, Albert, Yao, Yan Han, Wu, Meng Yueh, Chang, Cheng Kai, Lo, Roger, Chen, Eason
Publikováno v:
2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p465-469, 5p
Autor:
Jung, Yanggyoo, Lee, Minjae, Park, Sunwoo, Ryu, Dongsu, Jung, Youshin, Hwang, Chanha, Lee, Choonheung, Park, Sungsoon, Jimarez, Miguel, (M J) Lee, Myung-June
Publikováno v:
2012 IEEE 62nd Electronic Components & Technology Conference; 1/ 1/2012, p439-443, 5p
Publikováno v:
2012 IEEE 62nd Electronic Components & Technology Conference; 1/ 1/2012, p1-24, 24p